ChipPAC EconoCSP Package Offers Cost-Effective Solution for Mobile Products.

SANTA CLARA, Calif.--(BUSINESS WIRE)--March 23, 1999--ChipPAC, Inc. has announced immediate availability of the EconoCSP(tm) chip-scale packages for mobile applications. The EconoCSP is a cost-effective solution for those applications requiring a single chip with a reduced footprint and high I/O density.

The EconoCSP package is targeted for ASICs, digital signal processors, flash memories, SRAMs and other devices meant for mobile applications. The EconoCSP package is ideal for ball counts less than 350 pins. Ball pitches of 0.5mm through 0.8mm are available. With a typical height of 1.2mm and below, the package is ideally suited for applications where packaging height constraints are a critical factor. Typical applications include cost-sensitive mobile applications such as camcorders, cell phones, notebook computers, personal digital assistants, pagers, and digital cameras.

The EconoCSP package utilizes a pancake approach to substrate architecture by molding all packages at once and then sawing them so that the cost of individual tooling for each body size can be eliminated. The devices are available using either laminate or tape substrates.

Satya Chillara, ChipPAC's director of marketing, said, "Our goal is to offer our customers the broadest number of advanced packaging options. With the introduction of the EconoCSP, we can offer a solution that gives our customers a choice in selecting a cost-effective packaging option without sacrificing board space or performance."

The EconoCSP provides a state-of-the-art replacement for thin small-outline packages (TSOPs) and thin quad flat pack packages (TQFPs) and is available now in sample quantities, with volume production available in the second quarter.

Earlier this year, ChipPAC introduced space-sensitive side-by-side and stacked molded multi-die chip-scale (M2CSPO) packages for memory/memory, memory/logic, logic/logic or logic/analog options.

ChipPAC is one of the few assembly-and-test companies in the world that is a full-portfolio supplier. The company offers a full array of packaging, from basic 6-pin to 2000-pin BGA/CSP and leadframe packages. These packages are offered in wire-bond and flip-chip processes. The company has 3500 employees worldwide, with sales offices in Boston, Dallas, Phoenix, San Diego, Santa Clara, Japan, Korea, Singapore, and The Netherlands. ChipPAC's ISO 9002-certified manufacturing facilities are located in Ichon, Korea and Shanghai, China. Worldwide headquarters are located in Santa Clara, CA. Additional information about ChipPAC is available on the worldwide web at http://www.chippac.com.

ChipPAC 3151 Coronado Drive Santa Clara, CA 95054 Tel: [phone] Fax: [phone]

EconoCSP and M2CSP are trademarks of ChipPAC, Inc.

NOTE TO EDITORS: M2CSP is actually "M-squared", so the "2" should be a superscript.