ChipPAC Adopts Cadence IC Packaging Design Technology for Use Worldwide; Deployment Supports Increased Automation, Reduced Cycle Times.

Business Editors/High-Tech Writers

SAN JOSE, Calif.--(BUSINESS WIRE)--Feb. 27, 2002

Cadence Design Systems, Inc. (NYSE:CDN), the world's leading supplier of electronic design products and services, announced today that ChipPAC, Inc. (Nasdaq:CHPC), one of the world's largest and most diversified semiconductor packaging, test and distribution providers, has standardized on the Cadence(R) integrated circuit (IC) packaging design suites, Advanced Package Designer and Advanced Package Engineer, to further automate its IC packaging design process and reduce cycle times. The design solutions are used to support all of ChipPAC's advanced IC packages including Ball Grid Array (BGA), Chip Scale (CSP), and Flip Chip.

"With operating frequencies common in the Giga-Hertz range and ball pitches moving to 0.5mm and less, it is critical that we have a flexible and robust design environment," said Bret Zahn, vice president of Worldwide Design and Characterization for ChipPAC. "The continuous improvement of the design process starts with the streamlined and consistent setup and execution of projects across worldwide design centers. With the use of the Cadence products, coupled with ChipPAC's proprietary SmartDESIGN process automation tools, we are accomplishing our goals. Many of our customers have also standardized on Cadence Advanced Package Designer, allowing for fast and easy collaboration across the design chain."

A key piece in the deployment of the Cadence technology at ChipPAC has been the use of SKILL, a process automation programming language that allows for continuously improving, standardizing and speeding the design process. Cadence packaging tools enable the use of SKILL through flexible software architecture. ChipPAC uses SKILL to export formatted Cadence data base files that can then be imported into other custom programs for the pro-active electrical, mechanical, and thermal analysis of the package design.

"With the increase in high-speed products -- and the resultant design challenges -- it is critical that an IC packaging process have an integrated design and analysis environment," said Jamie Metcalfe, vice president of strategic marketing for the Cadence PCB Systems Division. "The Cadence SPECCTRAQuest signal design and analysis solution allows for dynamic signal integrity evaluation and design layout optimization. These issues are of major importance in ChipPAC's SmartDESIGN process."

SmartDESIGN(TM) is a proprietary, fully integrated IC packaging design and characterization process that includes electrical, mechanical, and thermal simulation analysis. It is designed to maximize product reliability and performance while minimizing design cycle times.

Cadence IC Packaging Technologies Link Silicon-Package-Board

Cadence Advanced Package Designer and Advanced Package Engineer solutions provide an advanced environment for the design and analysis of IC packaging. They are part of the overall Cadence PCB solution that allows engineers to consider the design and analysis of the silicon, the package, and the board. Included are the SPECCTRA(R) autorouter and, in Advanced Package Engineer, SPECCTRAQuest(TM) for IC Packaging.

About ChipPAC, Inc.

ChipPAC is a full-portfolio provider of semiconductor packaging design, assembly, test and distribution services. The company combines a history of innovation and service with more than a decade of experience satisfying some of the largest -- and most demanding -- customers in the industry. With advanced process technology capabilities and a global manufacturing presence spanning Korea, China, Malaysia and the United States, ChipPAC has a reputation for providing dependable, high quality packaging solutions. For more information, visit the company's Website at www.chippac.com.

About Cadence

Cadence is the largest supplier of electronic design automation products, methodology services, and design services. Cadence solutions are used to accelerate and manage the design of semiconductors, computer systems, networking and telecommunications equipment, consumer electronics, and a variety of other electronics-based products. With approximately 5,700 employees and 2001 revenues of approximately $1.43 billion, Cadence has sales offices, design centers, and research facilities around the world. The Company is headquartered in San Jose, Calif., and traded on the New York Stock Exchange under the symbol CDN. More information about the company, its products and services is available at www.cadence.com.

Note to Editors: Cadence, the Cadence logo, and SPECCTRA are registered trademarks and SPECCTRAQuest is a trademark of Cadence Design Systems, Inc. ChipPAC and SmartDESIGN are registered trademarks of ChipPAC, Inc. All other trademarks and registered trademarks are property of their respective holders.