ChipPAC, Inc. Appoints BK Sohn to Executive Vice President of Manufacturing Operations.

Business Editors/High-Tech Writers

SANTA CLARA, Calif.--(BUSINESS WIRE)--Feb. 2, 2000

ChipPAC, Inc., a privately held subcontract assembly, packaging and test company, today announced that BK Sohn had recently joined the company as Executive Vice President of Manufacturing Operations, based in the company's Korea facility.

&uot;ChipPAC is continuing on the aggressive path that we successfully put in motion last year, of hiring proven industry leaders to actively grow our share of the market,&uot; said Dennis McKenna, president and CEO of ChipPAC. &uot;Our approach to building a solid executive management team worldwide is fortified by the addition of Mr. Sohn. He was a key executive in packaging, putting into place a state-of-the-art manufacturing facility to build BGA and CSP packages.

&uot;This knowledge and experience will contribute to ChipPAC's goal of operational excellence. We realize that the demands of our customers, and subsequently their customers, drive us to create solutions and products for their current and future needs. A high-caliber executive team is vital to achieving this.

&uot;Mr. Sohn's main responsibilities will include the manufacturing operations of ChipPAC's four main business units -- BGAs, CSPs, Leaded Products and Test. Within these units, he will oversee the manufacturing, process, maintenance and production control-related areas.&uot;

Sohn comes to ChipPAC from Korea Circuit Co., Ltd., where he was the Senior Executive Vice President of the MLB Division, R& Center. Prior to that, he was with Anam Semiconductors for 26 years, where he held positions as Corporate Vice President, Q &RE Division, and Plant Manager for BGA and leaded packages. Sohn has an MS degree in Chemistry from Konkuk University in Seoul, Korea, and a BS degree in Chemistry from Korea University in Seoul, Korea.

About ChipPAC, Inc.

ChipPAC, Inc. is one of the few assembly and test companies in the world that is a full-portfolio supplier. The company offers a full array of packaging, from basic 6-pin to 2000-pin BGA/CSP and leaded packages. These packages are offered in wire-bond and flip-chip processes.

The company has 4000 employees worldwide, with sales offices in Boston, Dallas, Phoenix, San Diego, Santa Clara, Japan, Korea, Singapore and The Netherlands, and ISO 9002-certified manufacturing facilities located in Ichon, Korea, and Shanghai, China. ChipPAC headquarters are 3151 Coronado Dr., Santa Clara, Calif., 95054, 408/486-5900, www.chippac.com.