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Chip-to-PCB simulation.


SPEED2000 transient time-domain simulation tool analyzes power delivery system and signal return path in a non-ideal power supply environment of the entire system interconnect-from chip I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output.

I/O - Input/Output
 driver through IC package, across the PCB PCB: see polychlorinated biphenyl.
PCB
 in full polychlorinated biphenyl

Any of a class of highly stable organic compounds prepared by the reaction of chlorine with biphenyl, a two-ring compound.
 and back through another package and IC I/O buffer, i.e., chip to chip. Analyzes electromagnetic effects and field propagation The transmission (spreading) of signals from one place to another.  inside packages and board structures. Patented methodology permits co-simulation of the virtual system interconnect (1) To attach one device to another.

(2) A physical port (plug, socket) or wireless port (transmitter, receiver) used to attach one device to another.
 model using a circuit solver, 3D field solver, interconnect and transmission line solver simultaneously.

WHO: Sigrity Inc.

WEB: sigrity.com
COPYRIGHT 2004 UP Media Group, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2004, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Title Annotation:off the Shelf
Publication:Printed Circuit Design & Manufacture
Date:May 1, 2004
Words:89
Previous Article:System interconnect co-design.(off the Shelf)
Next Article:High-frequency laminate.(Others Of Note)



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