Chip substrate shortage seen.

AUSTIN, TX -- A May 1 fire that destroyed part of ASE's Chung-Li, Taiwan assembly and test capacity and decimated its flip-chip substrate production line will heap further pressure on an already tenuous tenuous Intensive care adjective Referring to a 'touch-and-go,' uncertain, or otherwise 'iffy' clinical situation supply of laminate laminate,
n a thin slice of porcelain or plastic fabricated in a dental lab, which is cemented to the front of the teeth to cover gaps, whiten stained teeth, or reshape chipped or broken teeth. substrates for semiconductor packaging.

Increased demand for laminate substrates this year, coupled with the ASE (Adaptive Server Enterprise) A relational DBMS from Sybase that runs on Windows NT/2000, Linux and a variety of Unix platforms. ASE is a comprehensive and robust data management product with a long history dating back to the late 1980s. fire, is expected to push prices higher for wirebond PBGA PBGA Plastic Ball Grid Array and flip-chip substrates, says research firm TechSearch International (www.techsearchinc.com). Unless capacity is expanded over existing plans, the situation could be similar for 2006, TechSearch said.

A TechSearch poll of key suppliers taken in the month after the Chung-Li fire revealed demand for flip-chip substrates, driven by graphics processors and chipsets, is expected to increase in the second half.

COPYRIGHT 2005 UP Media Group, Inc.
No portion of this article can be reproduced without the express written permission from the copyright holder.

Reader Opinion

Article Details
Printer friendly Cite/link Email Feedback
Title Annotation:	MARKET WATCH
Publication:	Printed Circuit Design & Manufacture
Date:	Aug 1, 2005
Words:	120
Previous Article:	Equipment slowdown ahead?
Next Article:	Fuba files bankruptcy, restructuring plan.

Related Articles
Flip chip packaging: a hot topic: flip chip technology appears to be one bright spot in the electronics industry after a difficult year.
Flip chip substrate demand taxing Taiwan capacity.
A new, thin high-performance organic substrate: the flip-chip package can be conventionally processed and meets lead-free demands.
Beyond assembly: alternative applications for high accuracy screen printing.
Using traditional SMT processes for semiconductor packaging: a two-part look at bumping and encapsulation of flip-chip BGAs.
Ghosts past, present and future: why disasters (natural and otherwise) can promise future opportunities.
Using a printer in chip attachment and encapsulation: part two of a look at how traditional SMT processes address semiconductor packaging.
Will flip chip supply crack under demand? Limited capacity is driving longer delivery times and higher prices.
Flip-chip assembly.