Chip encapsulant.TRA-BOND 933-1 is a black, highly filled, electrically insulating epoxy epoxy Any of a class of thermosetting polymers, polyethers built up from monomers with an ether group that takes the form of a three-membered epoxide ring. The familiar two-part epoxy adhesives consist of a resin with epoxide rings at the ends of its molecules and a curing encapsulant en·cap·su·lant n. A material used for encapsulating. that is designed for encapsulating microelectronic chips. The product is moisture resistant and offers protection from mechanical and environmental hazards. A low coefficient of thermal expansion coefficient of thermal expansion, n See expansion, thermal coefficient. minimizes stress effects on components and wiring during thermal shock Thermal shock in mechanical models Thermal shock is the name given to cracking as a result of rapid temperature change. Glass and ceramic objects are particularly vulnerable to this form of failure, due to their low toughness, low thermal conductivity, and high tests. The product can be stored at room temperature, as its working life is two months in this condition. The encapsulant also exhibits lower moisture sensitivity than anhydride-cured systems. Tra-Con, Inc., Bedford, MA Circle 107 |
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