Chip Scale Package -- CSP -- Reduces Board Space for DDR or SSTL Terminations; CAMD's Thin Film Resistor Termination Array in CSP Format.

Business Editors/High-Tech Writers

MILPITAS, Calif.--(BUSINESS WIRE)--July 25, 2000

California Micro Devices (Nasdaq:CAMD)

In Brief...

-- 16 high frequency series/parallel termination channels

-- Integrates 32 resistors in a single device

-- CSP format occupies considerably less space than SOT or MSOP 

packaging

-- Absolute tolerance of +/-1.0% over temperature

California Micro Devices Corporation (CAMD) (Nasdaq:CAMD) announced today the CSPDDR100, a Double Data Rate (DDR) or Series Stub Terminated Logic (SSTL) termination array for use in computers, network infrastructure equipment such as servers, routers, switches and graphics accelerator cards. This device provides an integrated solution in Chip Sale Package (CSP) format for DDR and SSTL bus terminations where both series and parallel termination resistors are required. The device combines 32 resistors for a total of 16 termination channels and is currently the highest level of integration available for these applications.

As signal speeds in systems increase, engineers have to pay greater attention to the specifics of how transmission lines are terminated to maintain signal integrity, and the effect of the high speed signals on the rest of the system in which they are incorporated. This requires higher performance components, tighter tolerances and matching, and more attention to the layout and signal flow in the system. This new component meets those requirements for the emerging DDR RAMs, as well as other systems using SSTL termination structures.

Built using state-of-the-art thin film technology, the resistors have excellent high frequency performance (greater than 3GHz). This is far superior to traditional discrete resistors that have performance issues with harmonic frequencies in excess of 1GHz. To provide better impedance matching of the interconnections, and thus improved signal integrity on the transmission line, the resistors are trimmed to an absolute tolerance of +/-1% over temperature. Implementing the CSPDDR100 in a high-speed memory system will reduce ringing on the transmission lines, reduce crosstalk between lines, increase noise margins, and minimize EMI/RFI emission problems. Also, the chip scale technology provides a parasitic inductance, which is lower than conventional discrete resistors which, in turn, improves high-speed performance.

The CSP format is beneficial both in applications where very high performance is needed, and where board space is at a premium. It has a very small footprint that is only 5.79mm by 2.44mm for the full 32 resistors. This represents space savings of at least 485% over a discrete component solution. It also allows attachment to laminate printed circuit boards (PCBs), such as those made with FR-4, without using costly underfill (glue) to secure the devices to the board. The design layout of the PCB is simple since the bump pattern (4x9) allows easy flow through routing on the PCB. There is no need to change manufacturing equipment since existing surface mount technology equipment can be used to assemble these devices onto PCBs.

According to Ashok Chalaka, Vice President of IPD Marketing, "This chip was originally designed by CAMD in conjunction with the hardware engineers at 3Dfx Interactive, Inc. (Nasdaq:TDFX). With the growing need for higher performance graphics accelerators that are designed to operate at speeds in excess of 500MHz, proper terminations have become increasingly critical."

"We chose CAMD's CSPDDR100 since it offers the highest density among all passives by replacing 320 discrete resistors with 10 chips. Moreover, with the Chip Scale Packaging, performance is ideal at the high frequencies. This product enables 3Dfx to offer the most competitive and highest performance graphics card in the industry," said Brian Schieck, Sr. Systems Engineer at 3Dfx.

Pricing for the CSPDDR100 in 100K quantities is $0.41. Samples are available now and production lead-time is 6-8 weeks ARO.

Headquartered in Milpitas, California, California Micro Devices designs, manufactures and markets integrated thin film, silicon-based termination, filtering, and active electronic circuitry. Built in ISO 9000-registered quality system environments, California Micro Devices' products target the requirements of computer, networking, and communication-based customers for smaller, high density devices that operate at high frequencies with superior performance and functionality.