Ceramics Process Systems and sp(3) Diamond Technologies form Strategic Partnership.CHARTLEY, Mass. -- Ceramics Process Systems Corporation (CPS) (OTC Bulletin Board OTC Bulletin Board An electronic quotation listing of the bid and asked prices of OTC stocks that do not meet the requirements to be listed on the NASDAQ stock-listing system. : CPSX), a developer and manufacturer of Aluminum Silicon Carbide silicon carbide, chemical compound, SiC, that forms extremely hard, dark, iridescent crystals that are insoluble in water and other common solvents. Widely used as an abrasive, it is marketed under such familiar trade names as Carborundum and Crystolon. (AlSiC) thermal management and packaging solutions announced today a strategic partnership with sp3 Diamond Technologies, Inc. (sp3), a supplier of DiaTherm[TM] diamond heat spreaders and diamond products for solving thermal management challenges in high-performance applications. Geared towards meeting the growing market need for electronics packages with enhanced thermal dissipation requirements, the two companies are partnering to provide AlSiC packages incorporating diamond pins. Supplying superior thermal dissipation, the new packages provide manufacturers of electronic devices, such as graphics processors, transportation power modules and military communication components, with dramatic device power and reliability improvements through extremely high thermal conductivity (1,200 W/m-K) paths and a tailored, low coefficient of thermal expansion coefficient of thermal expansion, n See expansion, thermal coefficient. (CTE (Coefficient of Thermal Expansion) The difference between the way two materials expand when heat is applied. This is very critical when chips are mounted to printed circuit boards, because the silicon chip expands at a different rate than the plastic board. ). The low density and high strength and stiffness values of AlSiC present added advantages over denser, traditional materials. "We are excited to enter into this partnership with CPS, as our unique thermal management technologies are a perfect complement to each other," commented Dwain Aidala, President of sp3Diamond Technologies. "We have immediately added the industry-proven CPS AlSiC packages with diamond pins to our product portfolio, and look forward to the increased market penetration that this partnership will provide." "The partnership reflects the increasing use of cost-effective diamond heat spreaders in multiple applications to improve hot spot heat transfer capability in packages," stated Grant Bennett, President of CPS. "Diamond has been talked about for a long time as a potential thermal management product, having obvious benefits but a price tag associated with it. Through this partnership, we are able to deliver a package that offers all the benefits of diamond heat spreaders in a cost-effective manner." Diamond has decreased in cost significantly due to its increased use in both electronic and cutting-tool applications. While the cost of diamond is higher on a volume basis compared to other heat-spreader materials, its bill-of-materials cost is low. The increased use of diamond heat spreaders in multiple markets and applications continues to reduce its portion of total device cost. Encapsulating a diamond pin with a thin layer of AlSiC, a metal-matrix composite, and strategically placing the diamond pins near hot spots hot spots acute moist dermatitis. provides an extremely high thermal path through the package, acting as a vertical solid state heat pipe to conduct heat away from hot spots and out of the package. The addition of thermal pyrolytic py·rol·y·sis n. Decomposition or transformation of a compound caused by heat. py  ro·lyt graphite at the top of the package dissipates the heat across a broad area at the surface of the package. sp3 adds AlSiC packages incorporating diamond pins to its product portfolio, which includes DiaTherm heat spreaders and diamond-on-silicon (DOS) wafers for MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. and thermal management applications, as well as diamond deposition reactors. CPS will also market AlSiC packages incorporating sp3diamond pins. About Ceramics Process Systems Corporation Ceramics Process Systems is the world leader in providing AlSiC thermal management components and electronic packaging products for the microelectronics, power electronics and automotive industries. Typical products include housings, lids, baseplates, thermal planes and other structures used where reliability and/or weight are important considerations. CPS' ISO (1) See ISO speed. (2) (International Organization for Standardization, Geneva, Switzerland, www.iso.ch) An organization that sets international standards, founded in 1946. The U.S. member body is ANSI. 9001:2000 certified manufacturing operations are located in Chartley, Massachusetts, USA. For more information about CPS and its products please visit www.alsic.com. About sp3 Diamond Technologies, Inc. sp3 Diamond Technologies is focused on providing diamond-based solutions for electronics thermal management, diamond-on-silicon applications, and enhanced cutting surfaces. Based in Santa Clara, California Santa Clara, California (IPA: /ˌsæntəˈklærə/) , founded in 1777 and incorporated in 1852, is a city in Santa Clara County, in the U.S. state of California. , USA, the company provides diamond products for thermal and cutting applications, diamond deposition services, hot filament filament, in astronomy: see chromosphere. CVD CVD Cardiovascular disease, see there reactors, and deposition consulting services to companies worldwide across a broad spectrum of industries. For more information about the company and its products and services please visit www.sp3inc.com. |
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