Browse Ceramic semiconductor packages topic

Ceramic semiconductor packages subtopic

Articles 1-22 out of 22 article(s) Title Author Type Date Words /FROM PR NEWSWIRE CHARLOTTE 704-338-9366/ TO BUSINESS AND TECHNOLOGY EDITORS:. Oct 23, 1998 461 SEMX Corporation Announces Second Quarter 1998 Results Jul 30, 1998 919 Oki Licenses DSP Group's OakDSPCore(R) Jun 9, 1998 668 KEMET Announces Restructuring Plan for U.S. and Mexican Operations; $18 Million Near-Term Savings Expected. Nov 11, 1997 470 Integrated Packaging Assembly Corporation expands, buys its own building. Mar 18, 1997 279 Microelectronic Packaging receives $3.4 million order from Schlumberger unit. Mar 10, 1997 474 New Microelectronic Packaging Management Team Announces Changes in Corporate Structure. Mar 3, 1997 594 Integrated Packaging Assembly Corp. Reports Earnings for Fourth Quarter 1996. Jan 21, 1997 831 Microelectronic Packaging announces results for third quarter, nine months; management and director changes. Nov 21, 1996 1533 Microelectronic Packaging names Denis J. Trafecanty Chief Financial Officer. Oct 8, 1996 339 New ProLinx IC Packaging Technology Promises Semiconductor Industry Higher Pin Counts and Higher Performance at a Significantly Lower Cost. Sep 10, 1996 869 Panda Project's semiconductor package achieves another milestone. Aug 13, 1996 416 IPAC Establishes New Internet Address at http://www.ipac.com. Jun 7, 1996 232 Microelectronic Packaging reports 1995 results. Apr 11, 1996 793 ACX TECHNOLOGIES' CERAMICS' BUSINESS WILL ENTER MICROPROCESSOR CERAMIC PACKAGE MARKET Jan 30, 1996 450 Alcoa Electronic Packaging to layoff virtually all employees. Jan 3, 1996 182 Gov. Romer honors Coors Ceramics. Dec 6, 1995 270 MICROELECTRONIC PACKAGING, INC. APPOINTS BDO SEIDMAN AS ITS NEW AUDITOR. Nov 29, 1995 190 Microelectronic Packaging reports profitable third quarter results; agrees to settle class action lawsuit. Nov 14, 1995 1228 Dr. Rao R. Tummala, former IBM fellow, becomes advisor to The Panda Project. May 3, 1995 502 SI Diamond completes acquisition of facilities and technologies from MCC; "Diamond Tech One" to be SIDT subsidiary. Apr 26, 1995 913 MICROELECTRONIC PACKAGING, INC. GRANTED WAIVER BY DBS BANK. Feb 10, 1995 187