Celestry Design Tools Qualified for TSMC 0.13-micron Process.Business Editors/High-Tech Writers SAN JOSE San Jose, city, United States San Jose (sănəzā`, săn hōzā`), city (1990 pop. 782,248), seat of Santa Clara co., W central Calif.; founded 1777, inc. 1850. , Calif.--(BUSINESS WIRE)--April 9, 2002 Celestry Design Technologies, Inc., the leading provider of Silicon Accurate Sign-off(TM) technology for the semiconductor and electronics industry, today announced qualification of three of its design tools for Taiwan Semiconductor Manufacturing Company (TSMC TSMC Taiwan Semiconductor Manufacturing Company, Ltd TSMC Taiwan Semiconductor Manufacturing Corporation TSMC Traffic Systems Management Center TSMC Toll Station Management Controller TSMC Transportation Supply Maintenance Command TSMC Technical Services Manager Code ) 0.13-micron process. The qualified tools include the RelPro+(TM) and RelXpert(TM) products for Hot Carrier Injection Hot carrier injection is the phenomenon in solid state devices or semiconductors where either an electron or a "hole" gains sufficient kinetic energy to overcome a potential barrier, becoming a "hot carrier", and then migrates to a different area of the device. (HCI (Human Computer Interaction) Refers to the design and implementation of computer systems that people interact with. It includes desktop systems as well as embedded systems in all kinds of devices. ) effects, and the AnalogXpert(TM) product for device mismatch simulation analysis (language, simulation) SIMulation ANalysis - (SIMAN) A simulation language, especially for manufacturing systems, developed by C. Dennis Pegden in 1983. ["Introduction to Simulation using SIMAN", C.D. Pegden et al, McGraw-Hill 1990]. for TSMC's analog/mixed-signal (AMS AMS - Andrew Message System ) process technologies. At the 0.13-micron node, new physical effects Physical effects is the term given to a sub-category of special effects in which mechanical or physical effects are recorded. Physical effects are usually planned in preproduction and created in production. result from the use of copper, more metal layers, thinner gate insulators, smaller device geometries and the effects of functional integration within the die. Designers who want to push higher performance while maintaining high yields must deal with these factors through physical analysis tools, such as those available from Celestry. "The qualification of Celestry's physical analysis design tools is a key step in providing designers with the capabilities they need for fast time-to-volume," said Genda Hu, vice president of marketing at TSMC. "With optimized technology files, designers can reduce their design time, facilitate better chip performance through careful calibration and validation, and increase the likelihood of first silicon successes." "We are pleased that TSMC continues to recognize our commitment to deliver industry-leading nanometer SoC design tools and our unique hands-on silicon experience that allows our customers to maximize their use of the latest IC processes with our Silicon-Accurate Sign-off solutions," remarked Dr. Zhihong Liu, president and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. of Celestry. About Celestry's RelPro+ and RelXpert for Hot Carrier Injection Analysis Celestry's RelPro+(TM) and RelXpert(TM) products respectively address how a design team can model HCI effects and simulate them. HCI degradation arises from aggressive design at small device geometries, most notably at the high critical field point. In the past, designers had no means of locating the problem areas and suffered performance losses by using larger design guardbands. For more details, refer to www.celestry.com/reliability. About Celestry's AnalogXpert AnalogXpert is a simulation product that provides fast and precise analysis of device mismatches and their impact on analog and mixed-signal circuits. By integrating AnalogXpert into their analog/mixed signal design flow, designers can develop higher performance products with greater accuracy and shorter time to market. About TSMC TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven library, IP, design tools and reference flows. The company has one advanced 300mm wafer fab in production and one under construction, in addition to seven eight-inch fabs and two six-inch wafer fabs. TSMC also has substantial capacity commitments at two joint ventures fabs (Vanguard and SSMC SSMC Sound Shore Medical Center (New Rochelle, New York) SSMC Sustainable San Mateo County SSMC Symbology Standards Management Committee SSMC Sungei Way Subang Methodist Church SSMC Surveillance Strike Maneuver Capability SSMC St. ) and at its wholly-owned subsidiary, WaferTech. In early 2001, TSMC became the first IC manufacturer to announce a 0.10-micron technology alignment Business and technology alignment, or just technology alignment, corrects terminology and assumptions used in business to better match those of technology and standards anticipated in the technology strategy and so-called technology roadmaps. program with its customers. TSMC's corporate headquarters are in Hsin-Chu, Taiwan. For more information about TSMC please go to http://www.tsmc.com. About Celestry Celestry is the leading provider of physical design products that enable integrated circuit integrated circuit (IC), electronic circuit built on a semiconductor substrate, usually one of single-crystal silicon. The circuit, often called a chip, is packaged in a hermetically sealed case or a nonhermetic plastic capsule, with leads extending from it for designers to achieve optimal performance from semiconductor process technologies. The Company offers software and services to electronic and semiconductor companies involved with the design of chips that are used in networking, communication, multimedia and computing products. For more information visit www.celestry.com or email info@celestry.com. Notes to Editors: Acronyms and Definition AMS: Analog Mixed Signal SoC: System on Chip HCI: Hot-Carrier Injection Celestry, the Celestry logo, AnalogXpert, RelPro+, RelXpert and Silicon-Accurate Sign-off are trademarks of Celestry Design Technologies, Inc. All other trademarks and tradenames are the property of their respective owners. |
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