Casio Micronics Develops Next-generation Chip-on-film.Tokyo, Japan, Sept 14, 2006 - (JCN JCN Japan Corporate News JCN Journal of Cognitive Neuroscience JCN Journal of Cardiovascular Nursing JCN Journal of Christian Nursing JCN Job Control Number JCN Journal of Child Neurology JCN joint communications network (US DoD) ) - Casio Micronics has developed a next-generation chip-on-film (COF), a film substrate for mounting liquid crystal driver chips on large-screen LCD panels Also called a "projection panel," it is a data projector that accepts computer output and displays it on a see-through liquid crystal screen that is placed on top of an overhead projector. See data projector. . The newly developed sample has an inner lead pitch of 25 microns. The company has collaborated with materials makers to change the compositions of polyimide Pronounced "poly-ih-mid." A type of plastic (a synthetic polymeric resin) originally developed by DuPont that is very durable, easy to machine and can handle very high temperatures. Polyimide is also highly insulative and does not contaminate its surroundings (does not outgas). film and solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i. resist in order to improve the reliability of the COF, which has copper wires laid on polyimide film. The company has also worked with materials maker partners to change the expansion coefficients of the materials so that they become closer to that of liquid crystal glass in order to minimize the misalignment mis·a·ligned adj. Incorrectly aligned. mis  a·lign ment n. of wires when the COF and the LCD panel are connected. Other technologies Casio Micronics has developed to commercialize the new COF include a new etching process that enables vertical etching of the sides of a wire, a chip bonding process that uses a highly insulating sealing resin co-developed with another company, and a new chip bonder and tester. The Company is building a dedicated next-generation COF production facility at its Yamanashi plant, which will begin operations with an initial monthly output capacity of 15 million units in the first quarter of 2007. Copyright [c] 2006 Japan Corporate News Network. All rights reserved. |
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