CardXX Signs Agreement with Innovatier to License Its RAMP Technology.ENGLEWOOD, Colo. -- CardXX, Inc. (Pink Sheets:CXCQ), a leading smartcard manufacturer, today announced that the Company has entered into an agreement with Innovatier, Inc. to license its RAMP technology and distribute products manufactured using the RAMP process. Under the agreement, Innovatier will agrees to pay CardXX a licensing royalty of 5% of the final assembly cost for each unit produced and sold. Innovatier expects to sell approximately 400,000 units per month. "The execution of this agreement is the first of many such licensing relationships the company expects to become involved with," states Paul Lewis Paul Lewis may refer to one of the following
(2) The transmission of one network protocol within another. of complex electronics in many different form factors. As more devices become 'smart,' we expect the demand for our process to increase steadily." CardXX has developed patented technologies to securely encapsulate en·cap·su·late v. 1. To form a capsule or sheath around. 2. To become encapsulated. en·cap electronics into Smart Cards Example of widely used contactless smart cards are Hong Kong's Octopus card, Paris' Calypso/Navigo card and Lisbon' LisboaViva card, which predate the ISO/IEC 14443 standard. The following tables list smart cards used for public transportation and other electronic purse applications. and other portable devices or form factors. The CardXX process offers the following unique advantages: --Injected thermoset A polymer-based liquid or powder that becomes solid when heated, placed under pressure, treated with a chemical or via radiation. The curing process creates a chemical bond that, unlike a thermoplastic, prevents the material from being remelted. See thermoplastic. polymer encapsulates and protects all electronic elements completely and securely --Low-temperature and low-pressure process prevents damage to delicate electronics and improves manufacturing yield --Superior heat resistance and chemical resistance protects against physical and chemical attacks --Physical access to chip electronics is difficult to obtain without severe damage or destruction of the chip About CardXX CardXX provides secure encapsulation of advanced electronics through manufacturing and licensing secure and intelligent Smart Cards using its proprietary, patented encapsulation process known as the Reaction Assisted Molded Process (RAMP). The Statements contained in this release that are not purely historical are forward-looking statements within the Private Securities Litigation Reform Act The Private Securities Litigation Reform Act of 1995 (PSLRA) implemented several significant substantive changes affecting certain cases brought under the federal securities laws, including changes related to pleading, discovery, liability, class representation and awards fees and of 1995 and are subject to various risks, uncertainties and other factors that could cause the Company's actual results, performance or achievements to differ materially from those expressed or implied by such forward-looking statements. Forward looking statements include, but are not limited to, those relating to relating to relate prep → concernant relating to relate prep → bezüglich +gen, mit Bezug auf +acc demand for the Company's services, expected demand for our services and expectations regarding our revenues, the Company's ability to continue to utilize goodwill, to continue to increase gross margins, to achieve and manage growth, to develop and market new applications and services, risks relating to the acquisition and integration of acquired businesses, demand for new services and applications, timing of demand for services, industry strength and competition and general economic factors. Investors are directed to consider such risks, uncertainties and other factors described in documents filed by the Company with the Securities and Exchange Commission. |
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