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Articles 1-38 out of 38 article(s) Title Author Type Date Words Rubicon Technology, Inc. Provides Additional Details on Production Capacity Expansion Plans. Dec 21, 2009 926 United States : Ansys Soars; Hapoalim Says Buy; Sees Play On Solar Capacity Expansion. Dec 18, 2009 260 Chartered Begins Next Phase of Equipment Move-in at Fab 7 in Support of Planned Capacity Expansion for Leading-Edge Processes. Dec 16, 2009 447 Nova Receives New Bookings of $2M for First Phase Capacity Expansion. Nov 10, 2009 553 United States: PNM wants to expand solar capacity. Aug 8, 2009 135 Himax ventures into market for analog IC chipsets. Brief article Aug 3, 2009 275 FC-CSP contracts straining capacity at ASE and siliconware. Jun 19, 2009 327 Massive capacity augmentation at BHEL-Trichy. Apr 23, 2009 571 India: Jindal Power to increase Tamnar plant capacity to 3,400 MW over 4 yrs. Dec 29, 2008 149 India: JPL to increase Tamnar plant capacity to 3400 MW over four yrs. Dec 29, 2008 143 Switzerland : ABB to expand semiconductor manufacturing capacity in Switzerland. Dec 22, 2008 288 Switzerland : ABB to expand semiconductor manufacturing capacity in Switzerland. Dec 20, 2008 286 Switzerland : ABB to augment manufacturing capacity in Switzerland. Dec 13, 2008 167 United States: ARC and Hellosoft Offer a VoIP Solution That Doubles the Channel Capacity of Comparable Embedded Solutions. Dec 5, 2008 164 NVIDIA Expands Capacity with Verigy V93000 SoC Tester Platform. Jun 17, 2008 506 Taiwan: Youngtek to expand LED sorting capacity to 1.8 billion units in June. Jun 4, 2008 176 India: BHEL takes over BHPV, seeks to increase capacity. May 13, 2008 295 Lexar Increases Capacity of Popular SDHC Memory Cards. Jan 8, 2008 792 Qimonda Focusing Production on 300mm Capacity to Improve Competitiveness. Nov 30, 2007 541 Skyworks Expands Manufacturing Capacity. Oct 25, 2007 1042 Tower Announces Plan to Further Ramp Up Its Fab 2 Capacity. Jul 16, 2007 912 Qimonda Strengthens Footprint in Asia: Expands Front-End Capacity with New 300mm Manufacturing Facility in Singapore. Apr 25, 2007 755 Qimonda Announces Expansion of Back-End Facility in China; Investment of Euro 250 million Will Double Capacity. Mar 8, 2007 832 Power Integrations' Newest PeakSwitch IC Supports Peak Loads up to 127 W. Mar 4, 2007 494 ArchPro Boosts Capacity, Performance of Multi-Volt Tools. Feb 21, 2007 412 Aegis Semiconductor Signs with Fabrinet to Expand Manufacturing Capacity of Channel Monitors. Nov 7, 2006 520 Amkor Continues Expansion of 300mm Wafer Bumping Capacity with SUSS MicroTec Lithography Solutions. Oct 24, 2006 605 Trio-Tech Plans Further Capacity Expansion at Its Flagship Singapore Facility. Oct 4, 2006 400 Renesas to Expand Production Capacity at Back-End Process Facility in Kyushu, Japan; A New Building at the Kumamoto Manufacturing Plant Will Consolidate the Operations of the Fukuoka Plant. Aug 31, 2006 440 ASPEED Makes Fast, Faster: Increases Effective Capacity of Intel Woodcrest; ACCELLERANT Boosts Performance Gains by Intel Woodcrest and Complier By 50 Percent in AMBook Application Benchmark. Aug 8, 2006 649 CPU Tech and IBM Collaborate on New Class of Semiconductor Devices; Acalis(TM) Programmable Semiconductor Devices add Flexibility, Capacity and Software Compatibility to Multi-Core Processing Solutions. Jul 20, 2006 333 Calypto Expands Sequential Analysis Capabilities with SLEC 2.0 Release; New Features And 100x Increased Capacity Enable Broad Base ESL Growth. May 22, 2006 645 Crucial Technology Launches FBDIMM Line and Issues FBDIMM White Paper Report; New Module Design Increases Memory Speed, Capacity and Reliability for Intel Bensley Platform. May 9, 2006 371 Integrated Materials Seeks Site for Asian Manufacturing and Support Center; New Location will Offer Semiconductor Fab Customers Expanded Technical, Sales Support, Capacity for SiFusion Furnaceware. Apr 11, 2006 551 Cypress Forges Foundry Agreement with Grace Semiconductor Manufacturing Corporation; Launches Flexible Manufacturing Strategy; Capacity Increase to Support Fast-Growing Consumer, Computation Products. Company Profile Dec 12, 2005 743 Hiroshima Elpida Commences Mass Production of 90 nm DRAM Chips on New 300 mm Wafer Production Line; Newly Expanded E300 Fab Targets 54,000 Wafers per Month, the Largest Semiconductor Capacity in Japan. Dec 1, 2005 541 AGERE STRORAGE CHIP INCREASES DISK DRIVE CAPACITY. Nov 1, 2005 1092 In-Depth Analysis of Intel's Manufacturing Capacity Revealed. Oct 7, 2005 202