Canon Receives Infineon Order for ArF Scanners; New High NA Tools Will Enable 100NM Chip Production.

Business Editors and Technology Writers

AMSTELVEEN, The Netherlands--(BUSINESS WIRE)--April 11, 2000

Canon Europa N.V., Semiconductor Equipment Division, today announced that the first production-ready units of Canon's new ArF scanner will be delivered to Infineon Technologies AG for use in DRAM production at the 100nm design rule.

According to Masami Aou, Senior General Manager of Canon Europa NV Semiconductor Equipment Division, the initial order from Infineon calls for the delivery of several Canon's 300-mm capable high NA 193-nm systems to their Dresden Module 2 facility. The Dresden location has already demonstrated the successful volume production of 64Mb DRAM on 300-mm wafers.

Johann Harter, Sen. Vice President, Frontend Manufacturing, Infineon Memory Products, affirming the announcement, said his company's aggressive move into DRAM production using 0.1-micron features and deep trench exposure characteristics not only mandated their decision to use 193-nm lithography but also required a careful evaluation of scanner performance. He identified lens system quality and overlay performance as key decisive factors.

Commenting on the announcement by Canon Europa, Phillip M. Ware, General Manager and Director of Marketing, Canon USA Semiconductor Equipment Division, said the order from Infineon is solid evidence that high-NA ArF systems are ready to move into the mainstream of mass production. Ware identified two factors attracting interest in the new system; Canon's heavy investment in ArF lens manufacturing and measurement infrastructure; and its use of the field-proven 5000 Series scanning platform already in its KrF machines being used for volume production.

Notes to editors:

The ArF scanners ordered by Infineon incorporate the latest enhancements achieved through Canon's extensive wavefront engineering program for scanner and stepper lens systems. The Canon ArF scanner uses a 4X reduction lens for single exposures over a 26 x 33mm field size. Its reduction projection lens system incorporates high-purity calcium fluoride elements and aspherical surfaces to provide high-contrast imaging and extremely low distortion. The Canon 5000 Series scanning platform offers an enhanced vibration isolation structure; lightweight, exceedingly high-speed reticle and wafer stages; and modularity. The platform converts readily from 200mm to 300mm wafer size.

Infineon Technologies AG, Munich, Germany, offers semiconductor solutions for applications in the wireless and wired communications markets, for the automotive and industrial sectors, for security systems and chip cards as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, and in the Asia-Pacific region from Singapore. In the fiscal year 1999 (ending September), the company achieved sales of Euro 4.24 billion (US $ 4.51 billion) with about 26,000 employees worldwide.

The Semiconductor Equipment Division of Canon Europa N.V., based in Amstelveen, The Netherlands, and the Semiconductor Equipment Division of Canon U.S.A., Inc., based in San Jose, Calif., supply step-and-repeat and step-and-scan photolithography tools for making integrated circuits including MR and GMR thin film heads for hard disk drives, and large active matrix liquid crystal flat panel displays. These are products of Canon's Semiconductor Production Equipment Group, in Utsunomiya, Japan, which is part of the company's Optical Products Operations.

Canon, Inc., comprising all Canon Group operations, is a $25-billion company with 81,000 employees. Its headquarters are in Tokyo, Japan, with approximately 80 sales companies, manufacturing companies and R&D centers, worldwide.

Canon U.S.A., Inc. is an industry leader in professional and consumer imaging solutions and, through its parent company, Canon Inc., is a top patent-holder of imaging technologies that give its customers KNOW-HOW. Canon employs 12,000 people at more than 30 facilities throughout North, Central and South American and the Caribbean.

All referenced product names are trademarks of their respective owners. Infineon and the Infineon logo are trademarks of Infineon Technologies AG.