Canadian Nano Fab Selects SUSS Wafer Bonder.MUNICH, Germany -- SUSS suss tr.v. sussed, suss·ing, suss·es Slang 1. To infer or discover; figure out: "I think I'm good at sussing out what's going on" Ry Cooder. MicroTec. (FWB (Fixed Wireless Broadband) See fixed wireless. :SMH SMH Sydney Morning Herald (Australia) SMH St Michael's Hospital SMH Shaking My Head SMH Strong Memorial Hospital SMH Sanders Morris Harris Inc. SMH Screening for Mental Health, Inc. ) (GER GER German/Germany GER Gastroesophageal Reflux GER Geriatrics GER General Education Requirement GER Great Eastern Railway (UK) GER Gross Enrollment Ratio (education) GER Gain Electrons Reduction :SMH), a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets announced today that the University of Alberta's NanoFab has selected its new ELAN CB6L wafer bonding equipment for its research and production activities. The NanoFab is an open access micro and nano fabrication fabrication (fab´rikā´sh  n),n the construction or making of a restoration. facility which is currently being used by over 130 research groups from the University of Alberta, other Canadian Universities and industry. The SUSS ELAN CB6L manual bonder will be used in nanotechnology research, pressure sensors for the oil industry, and RF MEMS switches for wireless applications. "The micro and nano fabrication equipment in our facility is virtually unequaled in Canada," says Dr. Ken Westra, Director of the NanoFab, which boasts an equipment set worth more than $20 million. Westra has over 20 years experience in MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. fabrication, thin films, and microfabrication in both industry and academia. "We are pleased to invest in the SUSS bonder as part of our strategy to provide the latest MEMS process technologies to our research partners," he said. "The University of Alberta is one of the best microfabrication research labs in North America," says Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec, Waterbury, Vermont, USA. "We are pleased that they have chosen the ELAN bonder to support process advances at the R&D level. In addition, researchers using the NanoFab will benefit from the ability to easily transfer technology developed on the ELAN bonder to any SUSS production wafer bonding system." The ELAN CB6L manual wafer bonder is designed specifically for research, development, and pre-production wafer bonding markets. It has the same core technology as the SUSS fully automated bonders - including precise temperature and force control during bonding, as well as computer controlled wafer processing - to ensure high-accuracy post bond alignment. Based on field-proven wafer bonding technology and supported by world-renown SUSS engineering and applications expertise, the ELAN is well suited for MEMS, optoelectronic, advanced packaging, and SOI (Silicon On Insulator) A chip architecture that increases transistor switching speed by reducing capacitance (build-up of electrical charges in the transistor's elements), and thus reducing the discharge time. The power requirement is also reduced in some designs. applications. About SUSS MicroTec SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders, probe systems and now equipment for C4NP production. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information about SUSS MicroTec, please visit www.suss.com. About The University of Alberta NanoFab: The NanoFab is an open access micro and nano fabrication facility for the university community, located in Edmonton, Alberta. Open access means the facility is open to any university research group. The facility is located in the ECERF ECERF Electrical and Computer Engineering Research Facility (University of Alberta, Canada) Building at the University of Alberta. The equipment list, currently valued at over $20 million, spans deposition, lithography, wet and plasma etching, and many other specialized tools. Unique capabilities included: Deep Silicon RIE n. 1. See Rye. Rie grass a - (Bot.) A kind of wild barley (Hordeum pratense b - Ray grass. - Dr. Prior. , Nano-scale lithography and Micro Embossing embossing, process of producing upon various materials designs or patterns in relief by mechanical means. The material is pressed between a pair of dies especially adapted to its hardness and the depth of the design needed. of plastic pieces. All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act The Private Securities Litigation Reform Act of 1995 (PSLRA) implemented several significant substantive changes affecting certain cases brought under the federal securities laws, including changes related to pleading, discovery, liability, class representation and awards fees and of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made. |
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