California Micro Devices Announces Major Shipment Milestone for Chip Scale Packaged Solutions.

Business Editors/High-Tech Writers

MILPITAS, Calif.--(BUSINESS WIRE)--July 18, 2002

Cumulative CSP Product Shipments Reach 20 Million Units In June

Demonstrating Market Acceptance And CSP Manufacturing Capacity

California Micro Devices (Nasdaq:CAMD) today announced that cumulative shipments of its chip scale packaged (CSP) products for mobile electronic applications have achieved a significant milestone of 20 million units shipped through June 30, 2002. Based upon widespread design adoption of its recently introduced family of six new CSP devices that integrate electromagnetic interference (EMI) filters and electrostatic discharge (ESD) protection, the company has quickly ramped volume production and established CSP production capabilities to support the continued demand growth for these products. In doing so, California Micro Devices has moved into a leadership position in the industry's expected transition to highly integrated, minimum form factor, application specific integrated passive (ASIPTM) solutions for wireless handsets and other mobile electronic devices.

Reduced Size, Increased Integration

By definition, a CSP device measures no more than 1.2x the size of the die it contains. California Micro Devices CSP products offer a 1x package-to-die ratio in that the packaged device has the same footprint as the die. The company's CSP technology combines proprietary thin-film processes with UltraCSP(TM), technology, a wafer bumping and re-distribution process licensed from the Flip Chip Technology division of Kulicke & Soffa. The chip is attached face down to the printed circuit board using solder bumps as interconnects, which improves the filter performance by eliminating the parasitic effects of wirebonds and lead frames, making California Micro Devices CSP the ideal solution for high frequency applications.

California Micro Devices combines CSP technology with its highly integrated ASIP(TM) devices to deliver industry-leading performance in an extremely compact form factor. For example, the CSPEMI306A, a general customer, 6-channel ESD/EMI filter for dataport applications, measures only 2.96mm x 1.33 mm in size and replaces 30 discrete passive components. Providing an 89 percent reduction in required board area, this device also reduces total cost of ownership by significantly reducing parts count.

"California Micro Devices was an early adopter of CSP technology and the first company to incorporate integrated passive devices (IPDs) into the CSP format," said Kyle Baker, vice president of marketing. "Our aggressive adoption of CSP packaging technology for our mobile electronics ASIPTM products has proved to be a winning combination for our customers, delivering superior high frequency performance, a significant reduction of solution footprint, and increased reliability compared to traditional discrete component implementations."

Significant Manufacturing Infrastructure and Support

At current volume levels, California Micro Devices believes it is the highest volume producer of UltraCSP(TM) Products for the mobile electronics industry. As the company prepares for a continued growth in demand, it is building a substantial manufacturing capacity for UltraCSP wafer processing and ball drop in addition to test and tape and reel processes. This investment, along with significant CSP manufacturing implementation knowledge gained as a result of being an early adopter, is expected to enable California Micro Devices to provide full support for its customers from pilot production through high volume manufacturing.

About California Micro Devices Corporation

California Micro Devices Corporation is a leading supplier of Application Specific Integrated Passive (ASIP) devices and related analog semiconductors. Within the company's broad product line are highly integrated solutions that ensure signal integrity, EMI (electromagnetic interference) filtering, ESD (electrostatic discharge) protection and smart power management for a broad spectrum of computing, mobile, consumer, lighting, and medical applications. Detailed corporate and product information may be accessed at www.calmicro.com.

All statements contained in this press release that are not historical facts are forward-looking statements. The forward-looking statements in this release are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. They are not historical facts or guarantees of future performance or events. Rather, they are based on current expectations, estimates, beliefs, assumptions, and goals and objectives and are subject to uncertainties that are difficult to predict. As a result, our actual results may differ materially from the statements made. Often such statements can be identified by their use of words such as will, intends, expects, plans, believes, anticipates, expects, and estimates. Forward-looking statements made in this release include our expectation that our CSP shipments will continue to grow in future quarters, the belief that we have achieved volume leadership in the shipment of CSP products to the mobile electronics industry, and the expectation that our build-up of CSP manufacturing capacity and CSP manufacturing knowledge will positively impact our future business prospects. These forward-looking statements are based upon our assumptions about and assessment of the future, which may or may not prove true, and involve a number of risks and uncertainties including, but not limited to the continued design-win acceptance of our CSP products. Due to these and other risks, the company's future actual results could differ materially from those discussed above. These forward-looking statements speak only as to the date of this release, and, except as required by law, we undertake no obligation to publicly release updates or revisions to these statements whether as a result of new information, future events, or otherwise.