Cadence and Amkor Announce Alliance to Provide System-in-Package -- SiP -- Technology Solutions.

Business Editors/High-Tech Writers

SAN JOSE, Calif.--(BUSINESS WIRE)--Sept. 4, 2000

Amkor Quickly Ramps Up With Working Production Designs for

New SiP Module Prototyping Line

Cadence Design Systems, Inc. (NYSE:CDN), the world's leading supplier of electronic design products and services, and Amkor Technology, Inc. (Nasdaq:AMKR), the world's largest provider of contract semiconductor packaging and test services, today announced the formation of a joint alliance to develop a leading-edge system-in-package (SiP) design flow.

Amkor quickly integrated Cadence(R) tools and methodologies, and within two months created production designs to address the integration of single and multiple high-performance IC packages, which included discrete and embedded passive components. Cadence's unique position as a full solution provider for both physical and electrical design of complex ICs, while providing the backbone for high-speed analysis, was key in Amkor's vendor selection for its new, advanced SiP design center in Chandler, Ariz.

In the agreement, Amkor will use Cadence's Advanced Package Designer software for the physical design of complex single and multiple IC package substrates and Advanced Package Engineer software for the electrical analyses of critical interconnect structures. Cadence also provided methodology services to assist in the rapid and efficient deployment of this design capability. The initial contract included both technology and services and is expected to continue growing as market demand for Amkor's SiP technology increases.

"The strategic importance of selecting a supplier who could perform electrical modeling and analysis at the packaging level was paramount," said Nozad Karim, director of SiP Design and Test, Amkor Technology, Inc. "Cadence's Advanced Package Designer software's tight integration with schematic captures, electrical parameter extractions, signal integrity, and RF design tools are essential for Amkor's needs. Cadence was chosen for this ability as well as for the company's advanced routing capabilities for multi-layer dense PCB and package substrates."

"Our abilities to design and analyze complex packages in the context of the silicon and system it's being designed for is essential for our customers to successfully deliver product to their customers in a timely manner," stated Paul Musto, senior product marketing manager, Cadence PCB Systems Division. "Cadence, as an EDA solution supplier, can meet the needs of an entire electronics supply chain by enabling integration between the various disciplines."

SiP Technology Addresses Complex High-Density Packaging

The industry trend is toward more complex, high-density packaging as the push to system-on-a-chip (SOC) and deep submicron continues in the silicon space. SiP has growing acceptance as a viable alternative to SOC as the industry begins to face the challenge of integrating multiple technologies on a single piece of silicon. With SiP, single or multiple ICs along with discrete and embedded components can be integrated in a high-performance, compact package that can be designed and manufactured very quickly, improving overall functionality and time-to-market.

Amkor's ability to serve the SiP market with advanced designs will expedite the pace of adoption. The company's newly established Chandler, advanced SiP module prototyping line (www.amkor.com/dbscripts/company_news/shownews.cfm?ID=105), with capabilities for high-speed, RF, and single and multi-chip packages, focuses on this area by providing close coordination between chip design, package design, manufacturing, and test development.

The Cadence/Amkor Alliance

The original agreement was signed in February 2000. At the onset of the alliance, Cadence deployed multiple resources through its Methodology Services group and field operations to ensure Amkor's success. In the first month, the products were installed, personnel trained, and production work started. This was especially challenging since Amkor was putting a new design team in place.

The Cadence Methodology Services team also began to analyze Amkor's technologies and processes to identify more productive methods that would result in a higher quality, more manufacturable designs, and faster turnaround times. At the same time, Cadence has been able to increase its knowledge and expertise and plans to continue working closely with Amkor to develop technology and services to address the fast growing SiP market.

About Amkor

Amkor is the world's largest provider of contract semiconductor packaging and test services. The company offers a complete set of services including deep submicron wafer fabrication, wafer probe testing, IC packaging assembly and design, final testing, burn-in, characterization and reliability testing. More information on Amkor is available from the company's SEC filings and on Amkor's web site, www.amkor.com.

About Cadence

Cadence is the largest supplier of electronic design automation products, methodology services, and design services used to accelerate and manage the design of semiconductors, computer systems, networking and telecommunications equipment, consumer electronics, and a variety of other electronics-based products. The Cadence PCB Systems Division, the worldwide PCB EDA market leader, addresses the entire range of design needs in the PCB market, with complete tool suites available on Windows, Windows NT, and UNIX platforms.

With approximately 5,100 employees and 1999 annual revenue of $1.1 billion, Cadence has sales offices, design centers, and research facilities located around the world. The company is headquartered in San Jose, and traded on the New York Stock Exchange under the symbol CDN. More information about the company and its products and services may be obtained from the World Wide Web at www.cadence.com.

Note to Editors: Cadence and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.