Printer Friendly
The Free Library
19,607,059 articles and books
Member login
User name  
Password 
 
Join us Forgot password?

Cabot Microelectronics Unveils New Dielectric Slurry That Enables a Ten-Fold Improvement in CMP Defectivity.


Business Editors/High Tech Writers

SEMICON SEMICON Semiconductors Equipment and Material International Conference  West 2000

AURORA, Ill.--(BUSINESS WIRE)--July 10, 2000

Unique chemistry of Semi-Sperse(R)D7300 reduces CMP CMP (cytidine monophosphate): see cytosine.


(1) (CMP Media LLC, Manhasset, NY, www.cmp.com) Part of United Business Media, CMP is a leading integrated media company that offers a wide variety of publications and services in the information
 microscratch

defects

Cabot Microelectronics Corp. (Nasdaq: CCMP CCMP Comprehensive Conservation and Management Plan
CCMP Counter-Mode/CBC-Mac Protocol (IEEE 802.11I encryption algorithm)
CCMP Capacitively Coupled Microwave Plasma
CCMP Coalition of Concerned Medical Professionals
), the leading supplier of chemical mechanical planarization (CMP) slurries, today announced the introduction of its new Semi-Sperse(R) D7300 dielectric dielectric (dī'ĭlĕk`trĭk), material that does not conduct electricity readily, i.e., an insulator (see insulation). A good dielectric should also have other properties: It must resist breakdown under high voltages; it should not  slurry, specifically developed for advanced interlevel dielectric (ILD (Inter Layer Dielectric) The insulation used between layers of aluminum or copper wire that interconnect the transistors in a chip. There are three to four layers in a memory chip and five to seven in a logic chip with hundreds of meters of wiring. ) applications. This newest addition to the company's line of industry-proven slurries enables a ten-fold reduction in post-CMP microscratching over available industry standard ILD slurries.

As device geometries shrink down to 0.18-micron and smaller, microscopic defects on the wafer surface become increasingly detrimental, adversely affecting the performance of today's most advanced integrated circuits Integrated circuits

Miniature electronic circuits produced within and upon a single semiconductor crystal, usually silicon. Integrated circuits range in complexity from simple logic circuits and amplifiers, about 1/20 in. (1.
 (ICs). Reducing these microdefects helps boost chip yields while optimizing cost of ownership.

"A breakthrough chemistry and improved abrasive particle technology were combined to create Semi-Sperse D7300 dielectric slurry. The result is not only improved defectivity, but also increased planarization efficiency and a wider process window," said Rick Foster, Director of Marketing at Cabot Microelectronics. "These product innovations become increasingly important and necessary as our customers shrink feature sizes below the 0.18-micron technology node See technology generation. ," Foster added.

Historically, slurry manufacturers have focused on modifying the abrasive particles dispersed in CMP slurry to achieve incremental Additional or increased growth, bulk, quantity, number, or value; enlarged.

Incremental cost is additional or increased cost of an item or service apart from its actual cost.
 improvements in defectivity. Cabot Microelectronics' scientists have discovered how to leverage proprietary chemical know-how to enable a significant reduction in CMP-induced defects while lowering the concentration of mobile ions introduced during the CMP process. Both improvements enable higher yields.

Cabot Microelectronics, headquartered in Aurora, Ill., is the leading supplier of CMP slurries for polishing various materials used in semiconductor manufacturing processes. The company's products play a critical role in its customers' manufacturing processes, enabling the manufacture of smaller, faster and more complex devices. Cabot Microelectronics is traded on Nasdaq under the symbol CCMP. For more information on Cabot Microelectronics, visit our website www.cabotcmp.com or call 1-630-499-2600.

The statements contained in this press release may contain "forward-looking statements." Actual results may differ materially from those anticipated in such forward-looking statements. All forward-looking statements are expressly qualified in their entirety by the risk factors and other cautionary statements included in Cabot Microelectronics' filings with the Securities and Exchange Commission.

Note to editors: Executives from Cabot Microelectronics will be available to discuss the new Semi-Sperse D7300 dielectric slurry in Booth No. 6348 during

SEMICON West in San Francisco San Francisco (săn frănsĭs`kō), city (1990 pop. 723,959), coextensive with San Francisco co., W Calif., on the tip of a peninsula between the Pacific Ocean and San Francisco Bay, which are connected by the strait known as the Golden .
COPYRIGHT 2000 Business Wire
No portion of this article can be reproduced without the express written permission from the copyright holder.
Copyright 2000, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

 Reader Opinion

Title:

Comment:



 

Article Details
Printer friendly Cite/link Email Feedback
Publication:Business Wire
Geographic Code:1USA
Date:Jul 10, 2000
Words:392
Previous Article:Diamond Entertainment Corp. Monday announced a sizable order of assorted DVD titles.
Next Article:G&A Imaging Announces General Availability of EPISUITE 5.0.



Related Articles
Cabot Unveils New Oxide Slurry for Advanced Dielectric Processes; New Polishing Compound Extends CMP Performance to 0.18 Micron and Below Processes.
Cabot Unveils New Oxide Slurry for Advanced Dielectric Processes; New Polishing Compound Extends CMP Performance to 0.18 Micron and Below Processes.
Cabot MMD Introduces Industry's First Commercial Tungsten Slurry Capable of Polishing Tungsten Plugs in Damascene Structures.
Cabot's New Polysilicon Slurry Provides Improved Performance for Advanced DRAM Processes.
Cabot Debuts Lustra 2090 Ultra Polishing Slurry for Advanced Rigid Disk Substrates.
Cabot MMD Names Micron Researcher Karl Robinson to Head Epic CMP Polishing Pad R&D Program.
Cabot Microelectronics Unveils iCue Copper CMP Technology; CMP Process Solutions Accelerating the Adoption of Copper in the Semiconductor Industry.
Cabot Microelectronics Appoints Japan Business Manager.
Rohm and Haas Electronic Materials Introduces New Barrier Slurry for Low-Stress/Low-Pressure CMP.
Cabot Microelectronics Announces a Major Breakthrough in Tungsten CMP Technology with WIN(TM) CMP Slurries.

Terms of use | Copyright © 2012 Farlex, Inc. | Feedback | For webmasters | Submit articles