CVC Ships Connexion MOCVD Cluster Tool for Copper Deposition to Disk Drive Recording Head Manufacturer.Business Editors ROCHESTER, N.Y.--(BUSINESS WIRE)--April 25, 2000 CVC See CSC. , Inc. (Nasdaq:CVCI), a worldwide supplier of cluster tool equipment for the fabrication of thin film recording heads, semiconductor devices and optical components for the telecommunications market, announced that it has shipped its CONNEXION(R) Metal-Organic Chemical Vapor Deposition (MOCVD) Cluster Tool to a disk drive recording head manufacturer. This system will be used to deposit copper for an Advanced Writer application. CVC's new small footprint CONNEXION(R) MOCVD module features dual liquid injection and Atomic Layer Deposition A semiconductor manufacturing technique that deposits a single layer on a chip that is only one atom or one molecule thick. As elements on a chip decreased to below 100 nm, this essential technology for making the chip ever smaller became commercial after the turn of the 21st century. (ALD ALD abbr. adrenoleukodystrophy ALD, n.pr See adrenoleukodystrophy. ALD aldolase. ) capabilities. The demands associated with the increasingly small dimensions of GMR heads are requiring manufacturers to transition from Electro-Chemical Deposition (ECD) to MOCVD in some key process steps. Chemical Vapor Deposition offers filling capability, conformality and topological homogeneity unmatched by other methods. "This shipment represents a significant technology convergence milestone that demonstrates our success in applying CVC's leading-edge MOCVD product offering and technology expertise to both semiconductor interconnect metallization Met`al`li`za´tion n. 1. The act or process of metallizing. and magnetic thin film head applications," according to Dr. Mehrdad Moslehi, Senior Vice President and Chief Technology Officer. Moslehi added, "CVC is in a unique position to leverage our CVD CVD Cardiovascular disease, see there semiconductor interconnect proficiency into this exciting new area. Our MOCVD product offering further strengthens our position as a leading Cluster Tool supplier of thin film process solutions for advanced GMR and future generations of magnetic thin film heads." About CVC CVC provides cluster tool manufacturing equipment for Physical Vapor Deposition  This article or section is in need of attention from an expert on the subject.Please help recruit one or [ improve this article] yourself. See the talk page for details. (PVD PVD abbr. peripheral vascular disease PVD Peripheral vascular disease, see there ) by plasma sputtering or Ion Beam Deposition Ion Beam Deposition is a process of applying materials to a target through the application of an ion beam. In an ion source source materials - gases or evaporated solids - are ionized using electron ionization or by application of high electric fields (Penning ion source). (IBD), Ion Beam Etch (IBE), Diamond-like Carbon (DLC) and Metal-Organic Chemical Vapor Deposition (MOCVD). CVC's process solutions address the production of evolving tape and disk drive recording head fabrication, optical components for telecommunications and applications such as GaAs, passive components, MRAM, bump metallization, and next generation logic devices. CVC, Inc. with operations in Fremont, California; Alexandria, Virginia; and Rochester, New York This article is about the city of Rochester in Monroe County. For the town in Ulster County, see Rochester, Ulster County, New York. Rochester, once known as The Flour City, and more recently as The Flower City or provides customer service and technical support near major customer sites throughout the world. For more information about CVC, visit the World Wide Web at www.cvc.com. Forward Looking Statements This press release may be deemed to contain forward-looking information. Any forward-looking statements are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act The Private Securities Litigation Reform Act of 1995 (PSLRA) implemented several significant substantive changes affecting certain cases brought under the federal securities laws, including changes related to pleading, discovery, liability, class representation and awards fees and of 1995. Forward-looking statements, including statements as to industry trends, future economic performance, anticipated revenues and expenses, and products or service line growth, may be significantly and materially impacted by certain risks and uncertainties, including, but not limited to, failure to meet operating objectives or to execute the operating plan of the Company; competition; the cyclical nature of the data storage and semiconductor industries; risks associated with the acceptance of new products by individual customers and by the marketplace; risks associated with dependence on major customers; the impact of economic downturns in foreign markets; integration of acquired companies; attraction and retention of key employees; and other risks referenced from time to time in the Company's filings with the Securities and Exchange Commission, including, but not limited to, its Annual Report on Form 10-K for the year ended September 30, 1999 and the Company's prospectus, dated November 12, 1999, as filed with the SEC. |
|
||||||||||||||
Printer friendly
Cite/link
Email
Feedback
Reader Opinion