CSP solution.The Pyxis platform is a chip-scale packaging technology for highly integrated radio frequency (RF) modules. The platform builds upon the company's micro ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. ([micro]BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. ) technology and integrates flip chip, integrated passives in silicon and on polyimide Pronounced "poly-ih-mid." A type of plastic (a synthetic polymeric resin) originally developed by DuPont that is very durable, easy to machine and can handle very high temperatures. Polyimide is also highly insulative and does not contaminate its surroundings (does not outgas). and electromagnetic interference (EMI (ElectroMagnetic Interference) An electrical disturbance in a system due to natural phenomena, low-frequency waves from electromechanical devices or high-frequency waves (RFI) from chips and other electronic devices. Allowable limits are governed by the FCC. ) shielding techniques. The platform is designed to support and integrate a number of RF functions, such as power amplifiers, transceivers, filters and switches. Tessera Inc., San Jose, CA www.tessera.com [ILLUSTRATION OMITTED] |
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