CORRECTING and REPLACING Tessera Announces Licensing Agreement With SANYO.

Business Editors/High-Tech Writers

CORRECTION...by Business Wire

SAN JOSE, Calif.--(BUSINESS WIRE)--Sept. 24, 2003

In BW5304 issued Sept. 23, 2003: The package types microBGA, microBGA-F and microZ were spelled incorrectly throughout the press release dated Sept. 23, 2003. They should read: microBGA, microBGA-F and microZ (sted: micronBGA, micronBGA-F and micronZ).

The corrected release reads:

TESSERA ANNOUNCES LICENSING AGREEMENT WITH SANYO

Tessera, Inc. today announced that SANYO Electric Co., Ltd. (TSE:6764) and Tessera have signed a new licensing agreement. Under this agreement, SANYO has licensed Tessera's semiconductor packaging technology to package semiconductor devices utilized in a variety of consumer electronic products.

"Tessera is pleased to have SANYO join our list of licensees," said Kirk Flatow, Tessera's senior vice president, marketing and sales. "High density packaging has been an important enabler of smaller consumer electronic products, and chip-scale packages are incorporated into many kinds of SANYO products. We are delighted to be working with SANYO as they deploy Tessera's patented technology."

The addition of SANYO to Tessera's licensee family reflects Tessera's strategy to license packaging technology to a broad range of electronics companies. Included in Tessera's license with SANYO are over 150 patents covering Tessera's Compliant Chip(R) technology. This technology covers a broad range of chip-scale and multi-chip package types, including integrated circuit devices packaged in "face-down," "face-up," "fold-over," "stacked," and "system-in-package" (SiP) formats. These package types are marketed by Tessera as microBGA(R) for face-down orientations, microBGA-F for face-up orientations, and microZ(TM) for multi-chip solutions. Tessera's intellectual property is utilized in many forms of advanced packaging, covering a wide range of materials and assembly processes.

About Tessera, Inc.

Tessera develops semiconductor packaging technology that meets the demand for miniaturization and increased performance of electronic products. The company holds several hundred patents worldwide covering chip-scale and multi-chip packages (CSPs and MCPs). Tessera's licensees include some of the world's largest semiconductor and assembly manufacturers, such as AMD, Amkor, ChipPac, Hynix, Intel, Renesas, Sharp, Siemens, Sony, STMicroelectronics, Texas Instruments and Toshiba. Founded in 1990 and headquartered in San Jose, Calif., Tessera can be found on the World Wide Web at www.tessera.com.

Tessera, microBGA, Compliant Chip, and the Tessera logo are registered trademarks and microZ is a trademark of Tessera, Inc. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.