CFM Announces Multiple Sales of OMNI Wafer Processing Systems.

Business Editors

EXTON, Penn.--(BUSINESS WIRE)--Aug. 2, 2000

CFM Technologies, Inc. (Nasdaq:CFMT) today announced the booking of an order for two OMNI(TM) semiconductor wafer processing systems from a major US chip manufacturer. These systems are being purchased to meet increased capacity needs and supplement CFM systems already installed and in production.

"Logic manufacturers are using CFM's Full-Flow(TM) system technology to maintain a competitive economic edge," said Roger Carolin, President and CEO of CFM. "We are pleased to receive this vote of confidence from a highly regarded manufacturer. Our success with logic manufacturers and foundries, where process flexibility is critical, shows the value of CFM's Full-Flow(TM) technology on the customer's production floor."

CFM's OMNI(TM) system is designed to automatically load, clean, and etch 200mm silicon wafers in a patented single-tank process chamber. The design allows for flexibility in recipe selection and process sequences. The system integrates the processing, rinsing and drying into a single chamber, minimizing wafer movement and reducing the overall footprint of the system. Systems also are available for 150mm and 300mm wafer processing.

"The OMNI(TM) system has been designed to implement a broad spectrum of wet applications," said Steve Bay, VP of Technology and Marketing at CFM. "These processes support the new technologies being implemented in semiconductor fabs worldwide. CFM is making significant inroads where customers recognize the value of high-performance cleaning technology and unparalleled process flexibility in solving new wet-processing challenges."

CFM Technologies, Inc. is leading manufacturer of advanced cleaning equipment for the semiconductor industry. Its systems provide superior contamination control and processing capabilities using a totally enclosed processing chamber. Watermarks and other drying defects are eliminated through CFM's Direct-Displace(TM) IPA vapor drying technology. CFM historically has invested in technical innovations to lower cost of ownership.

The discussion above regarding the Company's expectation of future sales, product mix, backlog and order activity includes certain forward-looking statements on these subjects. As such, actual results may vary materially from such expectations. Factors which could cause actual results to differ from expectations include variations in the level of orders, which can be affected by general economic conditions difficulties or delays in product functionality or performance, the timing of future product releases, failure to respond adequately to either changes in technology or customer preferences or failure to realize a successful outcome to pending patent litigation.