CENiX Introduces New Product Supporting Long Haul Optical Networking Applications.

Business Editors & High-Tech Writers

AMSTERDAM, Netherlands--(BUSINESS WIRE)--Oct. 1, 2001

Leader in optoelectronic subsystems will exhibit its family of

high-speed integrated solutions during the European Conference on

Optical Communication (ECOC) in Amsterdam

CENiX Inc., a leader in the design and automated manufacture of next generation high-speed optoelectronic interfaces, today announced a new, innovative, scalable, optical subsystem targeted for use in the long haul market.

During the European Conference on Optical Communication 2001 (ECOC), being held in Amsterdam, CENiX will exhibit its feature rich subsystems which make optoelectronic interfaces easy for optical equipment manufacturers by allowing for higher systems density and additional functionality on a system board.

The ULTRAPAK10(TM) is the next generation subsystem which is designed to operate at 10 Gbps to 12.5 Gbps (Super FEC rates) at distances of up to 120 km in a small form module. The ULTRAPAK10 is a highly integrated 300-pin MSA compatible DWDM module that is available at specific ITU wavelengths (50 Ghz channel spacing), in APD or PIN receiver configurations and operating temperature of 0 to 65(degrees) Celsius.

Sample quantities are available December 2001. Future enhancements to this unique product will include a digital wrapper and wavelength tuneability.

The UNiPAK10(TM), also a 10 Gbps subsystem, is backward compatible to the 300-pin MSA and is ideal for use in SONET, SDH, and Gigabit Ethernet systems in metro access and regional DWDM applications. The UNiPAK10 is compliant with ITU standards and provides advantages of reduced space, power and development time. Standard features include dither tone input and a designer friendly I2C external interface.

CENiX is currently shipping customers devices in a compact package size of 4.14-inch L x 3.36-inch W x 0.53-inch H. In early 2002, an even smaller package size of 2.50-inch L x 2.15-inch W x 0.47-inch H will be offered. This will be a 50% reduction from current solutions.

The TETRAPAK40(TM) offers the highest integration, density and capacity in the industry with greater than 5 gigabit kilometers per cubic-centimeter. The TETRAPAK40 features 4 parallel 10 Gbps channels using 1310nm uncooled lasers and PIN photodiodes for applications up to 20 km. The TETRAPAK40 offers an I2C external interface, built-in reference clock jitter filter, diagnostic and optical loop backs and supports SONET and FEC rates.

CENiX is currently delivering sample devices to customers in a compact package size of 6.50-inch W x 3.30-inch L x 0.53-inch H. This is more than half the size of solutions offered in the market today. In 2002, the package size will be compressed further to 2.72-inch W x 3.75-inch L x 0.47-inch H.

About CENiX Inc.:

CENiX was established in July 2000 to supply next generation high-speed integrated optical subsystems satisfying the growing bandwidth requirements of the Internet age. Optoelectronic interfaces are required to seamlessly move data and voice signals between the electrical and optical domains of the optical communications infrastructure.

Early stage funding was led by the Silicon Valley firm, Kleiner Perkins Caufield & Byers and included Cisco Systems, Dongah Elecomm and other strategic individuals.

CENiX has its manufacturing operations and corporate headquarters in Lehigh Valley, Pa. and its product development and marketing in Irvine, Calif. For more information, go to www.cenix.com.

Note to Editors: CENiX, TETRAPAK40, UNiPAK10 and ULTRAPAK10 are trademarks of CENiX Inc.