CENiX Introduces New 10 and 40 Gbps Optical Subsystems; Leader in optoelectronic subsystems unveils three new product lines during OFC 2001.

Business Editors, High-Tech Writers

LEHIGH VALLEY, Pa.--(BUSINESS WIRE)--March 19, 2001

CENiX Inc., a leader in the design and manufacture of next generation high-speed optoelectronic interfaces, today introduced several new innovative, scalable, optical subsystems targeted for use in 10 and 40 Gbps systems. During the Optical Fiber Conference (OFC) 2001, being held in Anaheim, CA, CENiX(TM) is showing working demonstrations of its products, which are ideal for optical networking applications in both long haul and metro market segments.

The company is introducing three new families of high-speed integrated solutions designated as UNiPAK.10(TM), TETRAPAK.10(TM) and TETRAPAK.40(TM).

The UNiPAK.10 delivers 10 Gbps bandwidth in a single footprint for intermediate and long-reach DWDM applications. This highly integrated optoelectronic subsystem includes a 10 Gbps 1.55um EML optical transmitter, a 10 Gbps PIN or APD optical receiver and a 16-channel Serializer/Deserializer. Standard features include Dither Tone Input, a designer friendly I2C External Interface and Clock Clean-up for SONET and FEC rates. Sample quantities are available now.

The TETRAPAK.40 delivers a 40 Gbps aggregated bandwidth to systems designers today. The compact design of the 15 km TETRAPAK.40 includes four 10 Gbps 1.3um DFB optical transmitters, four 10 Gbps optical receivers and four 16-channel Serializers/Deserializers with a built-in reference clock clean-up circuit supporting both SONET and FEC rates. Sample quantities are available May, 2001.

CENiX is also introducing the TETRAPAK.10 during OFC. This optical subsystem offers the highest level of functionality in a single optical subsystem for SONET/FEC implementation. This innovative product solution includes four 2.5 Gbps 1.3um Fabry-Perot or DFB optical transmitters, four 2.5 Gbps PIN or APD optical receivers and four 4-channel Serializer/Deserializer suitable for up to 60 km transport applications. Sample quantities will be available July, 2001.

"We are pleased to introduce these new families of optoelectronic interfaces that offer the highest capability in the industry with greater than 5 gigabit kilometers per cubic centimeter," stated Melvyn Dixon, President and CEO of CENiX. "Within a year we will improve this capability by a factor of three. Our products help to make optoelectronic interfaces easy for optical equipment suppliers, who are facing the need for increased bandwidth capability, reach, equipment density and high volume supply of quality optical components."

"Historically, the transport optical components industry has been primarily concerned with achieving performance through custom design and assembly," stated Karen Liu, Director of Optical Components for RHK Inc. "With the increases in volume and product functionality we've seen in the last year, the optical components industry is poised for the jump to the next level in terms of integration and automation. The ability to make that jump will be a critical differentiator for companies over the next few years."

CENiX is also introducing at OFC its initiatives that will establish an automated manufacturing capability to deliver these innovative new product developments in volume quantities, at the highest quality and lowest cost. "We are developing break-through manufacturing automation technologies using ultra high-precision, intelligent robotic systems and proprietary processes and software," stated Timothy Bock, Senior Vice President of Manufacturing and Process Development. "CENiX is truly advancing the state-of-art technology for optical subsystem assembly and test."

About CENIX Inc:

CENiX Inc. was established in July 2000 to design and manufacture the next generation integrated optical subsystems to satisfy the explosive bandwidth requirements of the Internet age. Optoelectronic interfaces are required to seamlessly move data and voice signals between the electrical and optical domains of any optical communications infrastructure. Early stage funding was led by the Silicon Valley firm, Kleiner Perkins Caufield & Byers and included Cisco Systems, Dongah Elecomm and other strategic individuals. CENiX has established its manufacturing operations and corporate headquarters in Lehigh Valley, Pennsylvania and its product development and marketing in Irvine, California. For more information visit www.cenixinc.com.

CENiX, TETRAPAK, and UNiPAK are trademarks of CENiX Inc.