CALIFORNIA MICRO DEVICES SIGNS PACT WITH FLIPCHIP.

California Micro Devices (CAMD) and Flip Chip Technologies (FCT), L.L.C. have signed a non-exclusive technology license agreement that provides CAMD with access to FCT's Ultra CSP manufacturing technology. This technology license will enhance CAMD's line of Integrated Passive Devices (IPD's) in chip scale packages and strengthen FCT's leadership position in the growing wafer-level packaging industry.

IPD's integrate multiple passive components into a single package; for example CAMD's P/Active(R) Super1284(TM) combines 42 discrete passive components and 17 electrostatic protection devices in a single 28-pin QSOP package. Chip scale packaging eliminates the bulky package, resulting in an IPD that is roughly the size of the die.

FCT's Ultra CSP(TM) technology allows system designers to attach IPD's and other electronic devices directly to a PCB without the use of underfill. Solder bumps are used to connect the IPD and the PCB, eliminating the need for wire bonding and the intermediate level packaging of traditional technologies. The Ultra CSP(TM) process together with CAMD's IPD technology will realize significant savings in board space, improved performance, and reduced system level costs for the customer.

"We are delighted with the licensing agreement with California Micro Devices which demonstrates our mutual commitment to excellence and advancement of the semiconductor packaging industry," stated Harry Hollack, president and CEO of Flip Chip Technologies. "Our ongoing partnership and today's agreement responds to our customer, whose voice provided the impetus that grows the popularity and value of chip scale packaging in today's electronic systems. Flip Chip Technologies looks forward to a continued partnership with CAMD as we work together to provide the computer and wireless industry with IPD's in chip scale packages," Hollack further stated.

"This agreement represents the natural next step in the partnership formed with Flip Chip Technologies over a year ago," stated Jeff Kalb, president and CEO of California Micro Devices. "The Ultra CSP technology will provide California Micro Devices with a significantly more cost-effective means of satisfying the increasing demand for high-performance, high-density components. Over the next three months, we will develop resources to provide our customers with products in chip scale packaging, the most advanced packaging technology to be used with IPD's today. As customer and industry demand for these products ramp up, we will be in position to service them."

CAMD will use FCT's resources and assistance in the implementation of the Ultra CSP(TM) technology.

California Micro Devices (CAMD), headquartered in Milpitas, designs, manufactures and markets integrated thin film, silicon-based termination and filtering components and active electronic circuitry. Built in ISO 9000 registered quality system environments, CAMD's products target the requirements of computer, networking, and communication-based customers for smaller, high density devices that operate at high frequencies with superior performance and functionality. For more information on CAMD, visit http://www.calmicro.com.

Flip Chip Technologies (FCT) is an innovative, high-volume wafer bumping resource providing IC packaging services and expertise to the semiconductor industry. A joint venture of Delphi Delco Electronics Systems and Kulicke & Soffa Industries, FCT is an ISO 9002 and QS 9000 certified company formed in 1996 (and based in Phoenix). FCT offers proven merchant bumping services used in applications requiring higher performance, reduced form factor, and lower costs than those obtainable through traditional surface mount techniques.

For more information, call 602/431-6020.