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Publications in Computers and office automation industries

1-28 out of 28 publication(s)
Publication Audience Format Latest Issue Articles
Computer Security Update Trade Newsletter May 1, 2013
631
Computergram International Trade Newswire Jul 21, 2004
11327
Computers and office automation community General Nov 29, 2011
4574
Database and Network Journal Trade Magazine/Journal Apr 1, 2013
2907
Digital Imaging Digest Trade Newsletter Mar 1, 2008
702
EDP Weekly's IT Monitor Trade Magazine/Journal Aug 29, 2005
3953
Electro Manufacturing Trade Newsletter May 1, 2013
840
GUI Program News Trade Newsletter May 1, 2013
936
Health Management Technology Professional Magazine/Journal Mar 1, 2013
4763
HIV Treatment: ALERTS! Trade Newsletter Mar 1, 2013
405
Imaging Update Trade Newsletter May 1, 2013
795
Informatica Professional Magazine/Journal Mar 1, 2013
409
Information Age (London, UK) Trade Magazine/Journal Feb 10, 2006
1265
Information Management Journal Trade Magazine/Journal Jan 1, 2013
2101
International Journal of Computational Intelligence Research Academic Magazine/Journal Jul 1, 2012
163
Internet Business News Trade Magazine/Journal May 23, 2013
14791
Japan Computer Industry Scan Trade Newsletter May 20, 2013
2776
Label & Narrow Web Trade Magazine/Journal Apr 1, 2013
5727
Language, Learning & Technology Professional Magazine/Journal Feb 1, 2013
505
MarketWatch: Business Intelligence Trade Magazine/Journal Jun 19, 2003
22
Mobile Business Advisor Trade Magazine/Journal Jan 1, 2005
358
Printed Circuit Design & Fab Trade Magazine/Journal Apr 1, 2013
  • In case you missed it.
  • Testing new grounds in automotive electronics: manufacturers are increasingly designing products for ease of test.
  • Two for the price of one: reducing solar silver costs using a dual-print process.
  • Negative Z to adjust for board warp: if you want to compensate for bow, you've got to get low.
  • Open circuit ball on TMV: could contamination be the culprit?
  • Fiducials in focus: good board and stencil alignment makes printing a snap.
  • Managing your ESD program: the processes are as important as the tools.
  • Stencil printing: the next big thing is actually very small: next-generation materials make almost every stencil better.
  • Bend, don't break: EMS companies showed their flexibility in 2012, adjusting to slowing consumer and defense markets.
  • SMT reflow oven-to-oven repeatability: how to adjust an oven so a single recipe will work across multiple ovens for an individual product.
  • Advanced block organization in schematic design and layout: reusing circuits using advanced block hierarchy.
  • Bare die on flex: has the time come for flexible printed circuits integration?
  • Microetch: the unsung hero: the right surface roughness sets the stage for subsequent plating.
  • Design for test in low-volume environments: grid testers are out, so how do you ensure quick and inexpensive ICT?
  • Finding the right contractor: issues that make or break an outsourcing relationship.
  • In need of an app: PCB equipment is long in the tooth. Time to get it talking.
  • PC outlook poor, IDC says.
  • PC crash.
  • 2013 iNEMI Roadmap webinar this month.
  • 'Wearable' electronics study snares UK grant.
  • 1930
    Printed Circuit Design & Manufacture Trade Magazine/Journal Sep 1, 2007
  • Top the line: reducing the line width, just the right amount, keeps differential impedance constant.
  • Transparent flex material.
  • Process/product management.
  • Flying probe tester.
  • Multilayer design tool.
  • Nanotech final finish.
  • Award winning designs: an interview with Peter Dill, 2007 winner of the Mentor Graphics PCB Technology Leadership Award.
  • A familiar picture: Ibiden reigned (again) as the top PCB fabricator in 2006.
  • Optoelectronic substrates--will it happen? The economic model for the optoelectronic interconnect favors high data rate transmission over moderate to...
  • BGA/PCB interconnect design guidelines: a successful BGA design is the right combination of pad diameter, drill diameter, anti-pad and aspect ratio...
  • Building and maintaining CAD libraries: choose library tools that store component and land pattern data in a generic format that can be used with any...
  • Electro-mechanical design team collaboration: new tools help global design teams meet time-to-market constraints.
  • Training for success: understanding the specific needs of your company is key to developing an employee development and training program.
  • Events.
  • InteliCoat Technologies, manufacturer of coated paper, film, and specialty substrates, announced it has sold its electronic and engineered films...
  • The Electronic Industries Alliance's board of directors has approved a plan that would split the assets of the trade goup coalition across five...
  • Valor Computerized Systems.
  • Inventor of the reverse interconnect process keynotes PCB East.
  • Laboratory expansion.
  • PCB shipments in summer slump.
  • 1359
    Rutgers Computer & Technology Law Journal Professional Magazine/Journal Mar 22, 2013
    170
    Soft-Letter Trade Newsletter Jul 31, 2001
    931
    Software World Trade Magazine/Journal Mar 1, 2013
    2964
    Wireless Sensor Network (WSN) Academic Magazine/Journal Jul 1, 2012
    235
    Worldwide Computer Products News Trade Magazine/Journal May 23, 2013
    11845

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