Printer Friendly

Publications in Computers and office automation industries

1-26 out of 26 publication(s)
Publication Audience Format Latest Issue Articles
Computer Security Update Trade Newsletter Oct 1, 2014
Computergram International Trade Newswire Jul 21, 2004
Database and Network Journal Trade Magazine/Journal Aug 1, 2014
Digital Imaging Digest Trade Newsletter Mar 1, 2008
EDP Weekly's IT Monitor Trade Magazine/Journal Aug 29, 2005
Electro Manufacturing Trade Newsletter Oct 1, 2014
GUI Program News Trade Newsletter Oct 1, 2014
Health Management Technology Professional Magazine/Journal Sep 1, 2014
HIV Treatment: ALERTS! Trade Newsletter Mar 1, 2014
Imaging Update Trade Newsletter Oct 1, 2014
Informatica Professional Magazine/Journal Jun 1, 2014
Information Age (London, UK) Trade Magazine/Journal Feb 10, 2006
Information Management Journal Trade Magazine/Journal May 1, 2014
International Journal of Computational Intelligence Research Academic Magazine/Journal Jul 1, 2012
Internet Business News Trade Magazine/Journal Oct 16, 2014
Japan Computer Industry Scan Trade Newsletter Oct 21, 2013
Label & Narrow Web Trade Magazine/Journal Sep 1, 2014
Language, Learning & Technology Professional Magazine/Journal Jun 1, 2014
MarketWatch: Business Intelligence Trade Magazine/Journal Jun 19, 2003
Mobile Business Advisor Trade Magazine/Journal Jan 1, 2005
Printed Circuit Design & Fab Trade Magazine/Journal Sep 1, 2014
  • Journal of Electronic Materials: Review of Capabilities of the ENEPIG Surface Finish.
  • SMTA International: Microstructure and Reliability Studies of Mixed SnPb and Pb-free BGA Soldering.
  • SMTA International: A Closed-Form Norris-Landzberg Solder Reliability Model.
  • SMTA International: QFN Design Considerations to Improve Cleaning --A Follow on Study.
  • Driving continuous improvement with an 8D framework: root cause identification and corrective action brought higher yields for an automotive PCB.
  • Who replaces the 'old guys'?
  • Tin whisker study conclusions: silver is a known whisker promoter but small amounts of bismuth mitigate the problem.
  • Peeling back graping: exhausted flux can cause incomplete reflow.
  • Study of various PCBA surface finishes: a total of nine groups of PCB surface finish were evaluated for solder spread and voiding performance with...
  • Libra industries finds its balance: changing markets and changing times have brought new management and new vision to the Tier III EMS.
  • The basics of flux residue and removal: cleanliness won't guarantee reliability, but contamination does affect performance.
  • Magnification vs. resolution in visual examination specifications: when it comes to defining measurement, industry standards are lacking. Is a...
  • Passing electrical signoff: the parameters of ESO, and how to efficiently ensure a design will pass.
  • Setup, tooling and NRE, oh my! Know the differences in one-off startup services, and what each entails.
  • Ten steps to 10GHz: properly compensating for high-frequency losses in the routed channels.
  • Will India become a global EMS provider? China's labor problems put India's EMS capability in a new light.
  • Management debacle offers food for thought: worker response to a CEO firing underscores the value of a great leader.
  • Q1 PCB design tool revenue up 1.6%.
  • Metals index.
  • More in storage.
  • 2278
    Printed Circuit Design & Manufacture Trade Magazine/Journal Sep 1, 2007
  • Top the line: reducing the line width, just the right amount, keeps differential impedance constant.
  • Transparent flex material.
  • Process/product management.
  • Flying probe tester.
  • Multilayer design tool.
  • Nanotech final finish.
  • Award winning designs: an interview with Peter Dill, 2007 winner of the Mentor Graphics PCB Technology Leadership Award.
  • A familiar picture: Ibiden reigned (again) as the top PCB fabricator in 2006.
  • Optoelectronic substrates--will it happen? The economic model for the optoelectronic interconnect favors high data rate transmission over moderate to...
  • BGA/PCB interconnect design guidelines: a successful BGA design is the right combination of pad diameter, drill diameter, anti-pad and aspect ratio...
  • Building and maintaining CAD libraries: choose library tools that store component and land pattern data in a generic format that can be used with any...
  • Electro-mechanical design team collaboration: new tools help global design teams meet time-to-market constraints.
  • Training for success: understanding the specific needs of your company is key to developing an employee development and training program.
  • Events.
  • InteliCoat Technologies, manufacturer of coated paper, film, and specialty substrates, announced it has sold its electronic and engineered films...
  • The Electronic Industries Alliance's board of directors has approved a plan that would split the assets of the trade goup coalition across five...
  • Valor Computerized Systems.
  • Inventor of the reverse interconnect process keynotes PCB East.
  • Laboratory expansion.
  • PCB shipments in summer slump.
  • 1359
    Rutgers Computer & Technology Law Journal Professional Magazine/Journal Mar 22, 2013
    Soft-Letter Trade Newsletter Jul 31, 2001
    Software World Trade Magazine/Journal Sep 1, 2014
    Worldwide Computer Products News Trade Magazine/Journal Oct 16, 2014

    Terms of use | Copyright © 2014 Farlex, Inc. | Feedback | For webmasters