Breakthrough Technology from Freescale Redefines State of the Art for Advanced Semiconductor Packaging; Innovative Approach Could Replace Ball Grid Array and Flip Chip as Preferred Packaging Technology for Miniaturized Devices.ORLANDO, Fla. -- Freescale Semiconductor Freescale Semiconductor, Inc. is an American semiconductor manufacturer. It was created by the divestiture of the Semiconductor Products Sector of Motorola in 2004. Freescale focuses their integrated circuit products on the automotive, embedded and communications markets. (NYSE NYSE See: New York Stock Exchange :FSL FSL - Formal Semantics Language. A language for compiler writing. ["A Formal Semantics for Computer Languages and its Application in a Compiler-Compiler", J.A. Feldman, CACM 9(1) (Jan 1966)]. [Sammet 1969, p. 641]. ) (NYSE:FSL.B), the company that developed and introduced the now widely-deployed ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. ) packaging technology, today unveiled yet another innovation that could replace BGA and flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done as the dominant packaging and assembly approach for advanced, highly integrated semiconductors. Redistributed Chip Packaging (RCP (networking, tool) rcp - (Remote copy) The Unix utility for copying files over Ethernet. Rcp is similar to FTP but uses the hosts.equiv user authentication method. Unix manual page: rcp(1). ) technology from Freescale offers unmatched flexibility and integration density -- characteristics that help deliver 30 percent smaller packaged semiconductor solutions versus traditional BGA technology. "The word 'revolutionary' is often overused, but RCP is a truly revolutionary technology," said Morry Marshall, vice president of Strategic Technologies, Semico Research Corp. "RCP will solve several packaging problems that have become ever more severe as ICs have increased in complexity. It is the semiconductor packaging technology of the future." RCP integrates semiconductor packaging as a functional part of the die and system solution. It addresses some of the limitations associated with previous generations of packaging technologies by eliminating wire bonds, package substrates and flip chip bumps. In addition, RCP does not utilize blind vias or require thinned die to achieve thin profiles. These advancements simplify assembly, lower costs, and provide compatibility with advanced wafer manufacturing processes utilizing low-k interlayer Noun 1. interlayer - a layer placed between other layers layer, bed - single thickness of usually some homogeneous substance; "slices of hard-boiled egg on a bed of spinach" dielectrics. The technology is easily adapted for 3G mobile phones and a broad range of consumer, industrial, transportation and networking devices that can benefit from the consolidation of electronic components into a single, miniaturized system. "Standard semiconductor packaging approaches will soon hit a wall of physical limitations," said Sumit Sadana, senior vice president, Strategy and Business Development, and Chief Technology Officer, Freescale. "RCP is a disruptive technology A new technology that has a serious impact on the status quo and changes the way people have been dealing with something, perhaps for decades. Music CDs all but wiped out the phonograph industry within a few years, and digital cameras are destined to eliminate the film industry. that overcomes these limitations and sets new industry benchmarks in flexibility, cost and integration density. Its unique capabilities will allow customers to create the smaller, sleeker and more efficient multifunction devices that the marketplace demands." RCP's exceptional flexibility makes it a virtually universal package technology that is applicable across a large number of applications and materials. It is compatible with advanced assembly technologies such as System in Package (SiP), Package on Package (PoP), and integrated cavity packages. Using RCP and PoP technology, Freescale has fabricated a radio-in-package that measures less than 25 x 25 millimeters. The radio-in-package contains all of the electronics required for a 3G mobile phone including memory, power management, baseband, transceiver and RF front end modules. Lead free and RoHS compliant, RCP meets reliability standards for commercial and industrial applications. Development and tests are in progress for automotive applications. Freescale maintains an extensive portfolio of intellectual property specific to RCP technology. The company expects products utilizing RCP technology will be available by 2008. Freescale intends to initially use RCP in its highly integrated wireless product families. About Freescale Semiconductor Freescale Semiconductor, Inc. (NYSE:FSL) (NYSE:FSL.B) is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial, networking and wireless markets. Freescale became a publicly traded company publicly traded company A company whose shares of common stock are held by the public and are available for purchase by investors. The shares of publicly traded firms are bought and sold on the organized exchanges or in the over-the-counter market. in July 2004 after more than 50 years as part of Motorola, Inc. The company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations in more than 30 countries. Freescale, a member of the S&P 500(R), is one of the world's largest semiconductor companies with 2005 sales of $5.8 billion (USD USD In currencies, this is the abbreviation for the U.S. Dollar. Notes: The currency market, also known as the Foreign Exchange market, is the largest financial market in the world, with a daily average volume of over US $1 trillion. ). www.freescale.com Reader Inquiry Response: Freescale Semiconductor P.O. Box 17927 Denver, CO 80217 USA Freescale (TM) and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (C) Freescale Semiconductor, Inc. 2006 |
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