Borealis Announces Smooth Wafer Technology.Business Editors LONDON--(BUSINESS WIRE)--Sept. 5, 2001 Power Chips plc, and Cool Chips plc, subsidiaries of Borealis Exploration Limited Borealis Exploration Ltd. is a Gibraltar-based research and development company that owns subsidiaries dealing with materials and power transfer. The company considers itself a virtual company, and is publicly traded. (BOREF), announce that a patent, titled "Wafer Having Smooth Surface", as Patent 6,281,139, was issued by the United States Patent and Trademark Office The United States Patent and Trademark Office (PTO or USPTO) is an agency in the United States Department of Commerce that provides patent protection to inventors and businesses for their inventions, and trademark registration for product and intellectual property on August 28th, 2001. Further patent applications related to Power Chips(tm) and Cool Chips(tm) technology are pending. Power Chips(tm) are small solid-state wafer devices capable of generating electricity from heat, or, in the case of Cool Chips(tm), pumping heat from one side of the device to the other when an electric current is applied, providing active cooling for a wide variety of potential applications. For more information about these technologies see our web sites at www.powerchips.gi and www.coolchips.gi. The new patent and other related patents are available on the web site. The patent describes a method for preparing a very smooth surface for wafers wafers compressed roughage in flat plates useful for feeding to animals in transit. in order to improve the precision with which wafer-based devices can be used. When silicon wafers are created, for example, they typically have a surface covered with tiny holes. While the wafer can be polished to produce a smoother surface, local depressions in the surface of the wafer persist. These depressions, or holes, limit the extent of detail that can be etched etch v. etched, etch·ing, etch·es v.tr. 1. a. To cut into the surface of (glass, for example) by the action of acid. b. onto the surface. The new patent involves depositing a base surface on the wafer, and then a second surface at an angle, so it does not fill the holes. A third surface is grown electrochemically in the holes, to fill them. Isaiah W. Cox, President of Power Chips plc, says "This innovation is very useful for Cool Chips and Power Chips, which benefit from flat surfaces. In addition, we expect that the techniques we describe in this patent will find applications within other semiconductor areas, such as semiconductor chip production as well as for obtaining good thermal contacts In thermodynamics, a thermodynamic system is said to be in thermal contact with another system if it can exchange energy with it through the process of heat. Perfect thermal isolation is an idealization as real systems are always in thermal contact with their environment to some with thermal interfaces and heat sinks A material that absorbs heat. Typically made of aluminum, heat sinks are widely used in amplifiers and other electronic devices that build up heat. Small heat sinks are the most economical method for cooling microprocessors and other chips. ." Borealis Exploration Limited has 5,000,000 shares outstanding. Borealis' business is reinventing the core technologies used by basic industries, including electric motors, steelmaking, electrical power generation, and cooling and refrigeration refrigeration, process for drawing heat from substances to lower their temperature, often for purposes of preservation. Refrigeration in its modern, portable form also depends on insulating materials that are thin yet effective. . Forward Looking Statement at http://www.borealis.gi/ForwardLookingStatement.htm |
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