BlueMoon Rising - Infineon Technologies Samples Bluetooth System Solution.Business Editors and High Tech Writers MUNICH, Germany--(BUSINESS WIRE)--Sept. 7, 2000 Infineon Technologies (FSE/NYSE: IFX IFX - ["Type Reconstruction with First-Class Polymorphic Values", J. O'Toole et al, SIGPLAN Notices 24(7):207-217 (Jul 1989)]. ) today announced that it has begun sampling its first Bluetooth(a) system solution for implementation of wireless device connectivity. The BlueMoon I chipset is one of the industry's smallest sized Bluetooth solutions in the market. With this solution, Infineon will extend its technological leadership and market position in the segment of advanced short range wireless systems. BlueMoon I includes an integrated baseband, link manager and host controller interface A host controller interface is a register level interface which allows a host controller for USB or FireWire to communicate with the operating system of a personal computer. chip, and a separate RF transceiver. Infineon has proven its system-on-chip expertise in the production of more than 25 million transceiver chips for cordless DECT (Digital Enhanced Cordless Telecommunications) A cordless phone standard mostly used in Europe; however, DECT 6.0 is increasingly used worldwide. The first DECT standards were introduced by ETSI in 1992, and DECT phones have been used as cordless home phones as phones and WDCT WDCT Worldwide Digital Cordless Telecommunications (equivalent to DECT) systems, which operate in the same frequency bands as Bluetooth. The BlueMoon system consists of two ICs, a versatile baseband controller and a highly integrated RF transceiver, making it the ideal solution for the integration into devices such as cellular phones, headsets, information appliances, PDAs and set-top boxes. "Our BlueMoon chipset presents a competitive industry benchmark for performance, miniaturization min·i·a·tur·ize tr.v. min·i·a·tur·ized, min·i·a·tur·iz·ing, min·i·a·tur·iz·es To plan or make on a greatly reduced scale. min , and high-volume manufacturability of Bluetooth-enabled devices," said Guenter Weinberger, Senior Vice President and General Manager of the Wireless Systems Group at Infineon Technologies. "We've designed a system that is fully software tunable and highly adaptable to any modifications made to the Bluetooth specification. It enables our customers to extend their leading position in the fastgrowing Bluetooth market segments." The cost-optimized single-chip baseband IC incorporates a link controller with an integrated PCM (1) See phase change memory. (2) (Plug Compatible Manufacturer) An organization that makes a computer or electronic device that is compatible with an existing machine. interface, UART (Universal Asynchronous Receiver Transmitter) The electronic circuit that makes up the serial port. Also known as "universal serial asynchronous receiver transmitter" (USART), it converts parallel bytes from the CPU into serial bits for transmission, and vice support for both software or hardware handshaking, and integrated program ROM. An external Flash interface is provided for rapid prototyping and early production start. The chip manufactured in an advanced CMOS (Complementary Metal Oxide Semiconductor) Pronounced "c-moss." The most widely used integrated circuit design. It is found in almost every electronic product from handheld devices to mainframes. process is available in two package options, a 7 x 7 mm LFBGA LFBGA Low-Profile Fine-Pitch Ball-Grid Array LFBGA Low Profile Fine Pitch Bga LFBGA Leadless Fine Pitch Bga 81 or a 14 x 14 mm TQFP See QFP. 100. The highly integrated RF transceiver features completely integrated receive and transmit paths. The receive path integrates the IF-filter on-chip and does not require any external filter to fulfill the Bluetooth specification. The excellent radio performance of the Infineon transceiver makes it possible to design applications with significantly longer working range than with competing solutions. Manufactured in an advanced BiCMOS process, the transceiver is available in a small outline, TSSOP TSSOP Thin Shrink Small Outline Package TSSOP Thin Scale Small Outline Package 38 package. About Infineon Infineon Technologies AG, Munich, Germany, offers semiconductor solutions for applications in the wireless and wired communications markets, for the automotive and industrial sectors, for security systems and chip cards as well as memory products. With a global presence, Infineon operates in the US from San Jose, CA, in the Asia-Pacific region from Singapore and in Japan from Tokyo. In the fiscal year 1999 (ending September), the company achieved sales of Euro 4.24 billion (US $ 4.51 billion) with about 26,000 employees worldwide. Infineon is listed on the DAX index of the Frankfurt Stock Exchange Frankfurt Stock Exchange The largest of Germany's eight securities exchanges, operated by Deutsche Borse AS. and on the New York Stock Exchange New York Stock Exchange (NYSE) World's largest marketplace for securities. The exchange began as an informal meeting of 24 men in 1792 on what is now Wall Street in New York City. (ticker symbol: IFX). Further information is available at www.infineon.com This press release and a press photo are available online at http://www.infineon.com/news Background Information Bluetooth is an emerging open industry standard which provides short range transmission between mobile PCs, phones and other electronic devices. This technology uses an unlicensed worldwide radio band in the 2.4 GHz frequency range. Initially conceived as a networking connectivity technology between unwired computers and cellular phones, the specification now includes profiles for many different types of home, business and general purpose electronic devices. Researchers at Cahners In-Stat (July 2000) estimate that Bluetooth radio sales could reach 1.4 billion units worldwide by 2005. To meet the projected growth of this market, effective Bluetooth solutions must be capable of deployment in a wide range of systems, enabling manufacturers to reach very high volume production levels. Bluetooth is a specification for low-cost, low-power and small form factor radio devices supporting data links at speeds up to 721 kilobit per second “KBPS” redirects here. For the AM radio station in Portland, Oregon, see KBPS (radio station). A kilobit per second (kbit/s or kb/s or kbps) is a unit of data transfer rate equal to 1,000 bits per second. (Kbps), including a 56 Kbps back channel or three voice channels. Defined by the Bluetooth Special Interest Group The Bluetooth Special Interest Group (SIG) is the body that oversees the development of Bluetooth standards and the licensing of the Bluetooth technologies and trademarks to manufacturers. (SIG), the specification is freely published and carries no licensing fees, helping to assure its adoption as a worldwide standard for device connectivity. Infineon, a member of the Bluetooth SIG since October 1998, has been working actively on the development of Bluetooth technologies for more than two years. About the Bluetooth SIG The Bluetooth(a) wireless technology is set to revolutionize the personal connectivity market by providing freedom from wired connections. It is a specification for a small-form factor, low-cost radio solution providing links between mobile computers, mobile phones and other portable handheld devices, and connectivity to the internet. The Bluetooth Special Interest Group (SIG), comprised of leaders in the telecommunications, computing, and network industries, is driving development of the technology and bringing it to market. The Bluetooth SIG includes promoter companies 3Com, Ericsson, IBM, Intel, Lucent, Microsoft, Motorola, Nokia and Toshiba, and 1883 Adopter/Associate member companies. Note (a) : Bluetooth is a trademark owned by its proprietor and used by Infineon Technologies under license. Abbrevations: BiCMOS Bipolar Complementary Metal Oxide Semiconductor CMOS Complementary Metal Oxide Semiconductor PCM Pulse Code Modulation ROM Read Only Memory UART Universal Asynchronous Receiver Transmitter DECT Digital Enhanced Cordless Telecommunications WDCT Worldwide Digital Cordless Telecommunications LFBGA Low profile Fine pitch Ball Grid Array TQFP Thin Quad Flat Package TSSOP Thin Shrink Small Outline Package |
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