Between 2006 and 2012 the Market for Printed Circuit Boards for the Automotive Sector is Expected to Double to over $5 Billion by 2012.DUBLIN, Ireland -- Research and Markets (http://www.researchandmarkets.com/reports/c82002) has announced the addition of High Performance Substrates For Automotive Applications 2006-2012 to their offering. With the increasing electronic content of the average vehicle and the exacting future requirements, substrates are a key component to facilitate increase automotive vehicle functionality. This report reviews the in-vehicle applications driving developments in this market sector and investigates the requirements for a range of advanced and novel substrates from flexible and flex-rigid to multilayer, microvia, thick copper, low loss high performance and ceramic. The report will provide substrate technology roadmaps The context of product management The existence of product managers in the product software industry indicates that software is becoming more and more commercialized as a standard product. for key applications and forecast of demand for specific PCBs by type and by region. Some of the key issues to be addressed in this report are thermal dissipation, high density interconnect and the bus protocols which enable higher data rates to accommodate the increased functionality. Contributing to this functionality are telematics Originally coined to mean the convergence of telecommunications and information processing, the term later evolved to refer to automation in automobiles. GPS navigation, integrated hands-free cellphones, wireless communications and automatic driving assistance systems all come under the applications such as satellite navigation, location-based services See mobile positioning. , remote diagnostics Vehicle Diagnostics Vehicle diagnostics enables a mechanic to diagnose the exact mechanical condition of the vehicle and its systems and components. Remote Diagnostics enables to perform such diagnosis without requiring the vehicle to physically be present for checkup. , emergency assist, airbag deployment notification, internet access See how to access the Internet. , mobile TV and Bluetooth. Other applications such as passenger comfort and infotainment place demands on interconnect in the cabin as well as under the hood under the hood - [hot-rodder talk] 1. The underlying implementation of a product (hardware, software, or idea). Implies that the implementation is not intuitively obvious from the appearance, but the speaker is about to enable the listener to grok it. and behind the dashboard. The plan by North America North America, third largest continent (1990 est. pop. 365,000,000), c.9,400,000 sq mi (24,346,000 sq km), the northern of the two continents of the Western Hemisphere. and Europe to tag all vehicles for distance tolling and emergency assist will further add to the electronic content of each vehicle. This study presents an up to date current assessment and future forecast of how the key substrate technologies will evolve. The research program involved the author in interviewing substrate suppliers, end users, EMS and ODM (Original Design Manufacturer) A contract manufacturer that uses its own designs and intellectual property (IP). See contract manufacturer. companies, materials and process equipment developers. In addition to this, BPA BPA British Paediatric Association. has used its proven and reliable forecasting techniques to predict the future structure and size of this exciting sector. This report will be of interest to all those who participate or are interested in participating in the automotive supply chain from assemblers This is a list of assemblers. Hundreds of assemblers have been written; some notable examples are:
n a thin slice of porcelain or plastic fabricated in a dental lab, which is cemented to the front of the teeth to cover gaps, whiten stained teeth, or reshape chipped or broken teeth. material suppliers. Importance of this Report -High performance substrates are key components in future generations of electronic system design, development and IC packaging for the automotive industry -The market for printed circuit boards for the automotive sector has increased from $1.85 billion in 2001 to more than $2.6 billion in 2006. -Between 2006 and 2012 it is expected to double to over $5 billion by 2012. -Environmental considerations will impact on electronics design and the materials used in vehicle manufacture. Benefits to You -This study provides a totally integrated assessment of the global automotive advanced substrate supply chain. -Identifies opportunities for small, medium and large players -Identifies the technologies, materials and processes that you will need to participate in these markets -Identifies winning strategies for successful players Content Outline: 1. EXECUTIVE SUMMARY 2. INTRODUCTION Background to Study Substrate Types Classification of Regions 3. AUTOMOTIVE ELECTRONICS REQUIRING ADVANCED SUBSTRATES Introduction Power and Under Hood Telematics Infotainment Safety and Security Passenger Comfort 4. SUBSTRATE TECHNOLOGIES AND MATERIALS Introduction Flexible Flex-Rigid Rigid and Microvia Low Loss Ceramic 5. STANDARDS AND RELIABILITY 6. MARKET FORECASTS 2006-2012 Introduction Automotive Market For Flexible And Flexrigid Automotive Market For Rigid And Microvia Automotive Market For Low Loss Pcbs Automotive Market For Ceramic Substrates Demand For Automotive Substrates By Region 7. KEY PLAYERS Introduction OEM (Original Equipment Manufacturer) The rebranding of equipment and selling it. The term initially referred to the company that made the products (the "original" manufacturer), but eventually became widely used to refer to the organization that buys the products and Tier 1 Fabricators Assembly The Impact of EMS and ODMs on the Supply Base Regional Market Future Market Structure 8. OPPORTUNITIES Summary Emerging Opportunities GLOSSARY For more information visit http://www.researchandmarkets.com/reports/c82002 |
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