Berkeley Process Control's New BXi/pa Integrated Pre-Aligner Provides Unmatched Accuracy, Speed and Reliability for 200 and 300 Mm Wafer Processing.RICHMOND, Calif.--(BUSINESS WIRE)--July 7, 1999-- Berkeley Process Control, Inc. (Berkeley), the global leader in integrated motion and machine control technologies, today announced its new BXi/pa integrated pre-aligner -- specifically designed to provide unmatched precision, speed and reliability for today's sophisticated 200 and 300 mm wafer (1) A small, thin continuous-loop magnetic tape cartridge that has been used from time to time for data storage and specialized applications. (2) The base unit of chip making. It is a slice taken from a salami-like silicon crystal ingot up to 12" (300mm) in diameter. handling processes. The introduction of the BXi/pa follows the recent introduction of Berkeley's new BXi motion and machine controller -- the inaugural product in Berkeley's Xtreme Control portfolio of highly integrated motion and machine control solutions for front-end wafer handling. The BXi/pa integrated pre-aligner, which performs up to four times faster than competitive notch notch (noch) incisure; an indentation on the edge of a bone or other organ. aortic notch dicrotic n. cardiac notch 1. aligners, was developed to provide a more precise and less costly way to align align (  līn),v to move the teeth into their proper positions to conform to the line of occlusion. wafers wafers compressed roughage in flat plates useful for feeding to animals in transit. . The BXi/pa is unique in that its control hardware and software are embedded Inserted into. See embedded system. in the BXi controller, creating a seamless interface between the aligner and the process tool. In addition, as the industry migrates toward 300 mm technology and the cost of these larger-diameter wafers escalates, accurate wafer alignment and improved throughput The speed with which a computer processes data. It is a combination of internal processing speed, peripheral speeds (I/O) and the efficiency of the operating system and other system software all working together. 1. are requirements for many tools. Commenting on how the new pre-aligner will affect OEMs and ultimately chipmakers, Berkeley President Paul Sagues stated, "As the transition to 300 mm technology gains momentum, chipmakers are mandating that OEMs develop systems that will improve fab uptime, yield and cost of ownership. The BXi/pa helps meet these objectives by increasing a process tool's reliability and throughput in the fab -- critical components that impact our customers' bottom line." Leveraging its 18-year history in the motion and machine control industry, Berkeley designed the BXi/pa to meet current and next-generation front-end process challenges. The result is the BXi/pa's unique architecture. All the control hardware and software, which typically require a dedicated controller, reside within the BXi controller. This plug-and-play compatibility simplifies the integration of the pre-aligner into a process tool. Berkeley's Autocalibration(TM) technology allows the BXi/pa to be installed, configured con·fig·ure tr.v. con·fig·ured, con·fig·ur·ing, con·fig·ures To design, arrange, set up, or shape with a view to specific applications or uses: and operational within minutes, compared with several hours for other systems. In addition, because there is no external data transfer, and therefore, no communication latencies, between the pre-aligner controller and the higher-level controller, throughput is significantly improved. Due to the elegant simplicity of its design, the BXi/pa leads the industry in reliability as well. The BXi/pa integrated pre-aligner provides superior performance at a significantly lower cost than competitive systems. Wafer notches can be oriented o·ri·ent n. 1. Orient The countries of Asia, especially of eastern Asia. 2. a. The luster characteristic of a pearl of high quality. b. A pearl having exceptional luster. 3. precisely with a repeatability of +/- 0.035 degrees. Used in conjunction with the BXi controller, the BXi/pa quickly locates the center of the wafer and orients it for the next process step with cycle times as low as 750 milliseconds -- significantly faster than the competition. Berkeley's new BXi/pa pre-aligner, as well as its other new Xtreme Control products will be previewed to audiences during SEMICON SEMICON Semiconductors Equipment and Material International Conference West 99, July 12-14. The system will be available beginning in Q3 1999 and has a list price of approximately 50 percent less than competing products. About Berkeley Process Control Berkeley Process Control, Inc., Richmond, a privately held company privately held company A firm whose shares are held within a relatively small circle of owners and are not traded publicly. founded in 1981, is the leading supplier of advanced automated au·to·mate v. au·to·mat·ed, au·to·mat·ing, au·to·mates v.tr. 1. To convert to automatic operation: automate a factory. 2. motion and machine control solutions for the critical manufacturing processes used in the semiconductor, fiber optic, packaging and aerospace industries. Berkeley's comprehensive and unique approach to factory automation enables faster time to market, greater machine productivity and seamless system integrity for original equipment manufacturers. To learn more about Berkeley, visit the company's Web site at www.berkeleyprocess.com |
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