BTU International First Quarter 2005 Earnings Conference Call.NORTH BILLERICA, Mass. -- BTU Btu: see British thermal unit. International, Inc. (Nasdaq NM:BTUI), the leading supplier of advanced thermal processing equipment used for printed circuit board assembly, semiconductor packaging and advanced materials Advanced Materials is a leading peer-reviewed materials science journal published every two weeks. Advanced Materials includes Communications, Reviews, and Feature Articles from the cutting edge of materials science, including topics in chemistry, physics, processing, will hold its quarterly conference call to discuss first quarter 2005 results and second quarter 2005 outlook on Friday, April 22, 2005, at 11:00 a.m. Eastern Time (10 a.m. Central Time). The dial-in number to participate in the conference call by telephone is (877) 236-1078. This call is being webcast by Thomson/CCBN and can be accessed at BTU's Web site at www.btu.com. The webcast is also being distributed through the Thomson StreetEvents Network to both institutional and individual investors. Individual investors can listen to the call at www.fulldisclosure.com, Thomson/CCBN's individual investor portal, powered by StreetEvents. Institutional investors Institutional Investor A non-bank person or organization that trades securities in large enough share quantities or dollar amounts that they qualify for preferential treatment and lower commissions. can access the call via Thomson's password-protected event management site, StreetEvents (www.streetevents.com). About BTU International BTU International is a market-leading supplier of advanced thermal processing equipment to the semiconductor, electronics, and materials sectors. BTU manufactures a wide range of equipment for semiconductor packaging applications, including state-of-the-art systems for wafer bumping and wafer-level packaging. The company is also a major manufacturer of solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i. reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text. furnaces for printed circuit board assembly, and advanced systems for materials processing Articles on Materials processing include:
|
|
||||||||||||||||
Printer friendly
Cite/link
Email
Feedback
Reader Opinion