BTU International Acquires Sagarus Robotics.Business Editors/High-Tech Writers NORTH BILLERICA, Mass.--(BUSINESS WIRE)--April 3, 2003 Acquisition Strengthens BTU's Industry-Leading, Fully-Integrated Solutions for Reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text. Processing of Bumped Semiconductor Wafers BTU Btu: see British thermal unit. International, Inc. (Nasdaq NM: BTUI), the leading supplier of thermal equipment for semiconductor packaging, surface mount, and advanced materials Advanced Materials is a leading peer-reviewed materials science journal published every two weeks. Advanced Materials includes Communications, Reviews, and Feature Articles from the cutting edge of materials science, including topics in chemistry, physics, processing, today announced that it has purchased the assets of Sagarus Robotics robotics, science and technology of general purpose, programmable machine systems. Contrary to the popular fiction image of robots as ambulatory machines of human appearance capable of performing almost any task, most robotic systems are anchored to fixed positions Corporation of Tempe, Ariz. Privately owned Sagarus Robotics is a leading provider of advanced, automated systems for the semiconductor packaging, MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. and sensor markets, including material handling equipment and integrated flux and photoresist A film used in photolithography that temporarily holds the pattern of a circuit path or microscopic element of a chip. When exposed to light, it hardens and is resistant to the acid bath that washes away the unexposed areas. Not to be confused with photoresistor. spin coaters that incorporate robotic handlers handlers persons involved in the handling of, for example, circus animals. Includes grooms, milkers, herdsmen, strappers. Used mostly in referring to persons handling animals for show or auction. for substrates from 100 to 300 millimeters. "Sagarus' products are a strategic addition to our product lineup for semiconductor packaging," said Mark Rosenzweig, President and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. of BTU International. "Our customers have clearly indicated a requirement for fully integrated, single-vendor solutions for their wafer-bump reflow process, including both the flux coating and thermal steps. BTU's market leading reflow systems and advanced thermal bumping technology combined with Sagarus' innovative processing tools represent a world-class package of process automation, process control and automated wafer handling. "BTU will continue to leverage its financial strength for further product expansion, as the opportunities present themselves in this down market," concluded Mr. Rosenzweig. Steve McKinley, President of Sagarus Robotics, said, "Sagarus is pleased to be joining forces with BTU to address the exciting wafer bump and handling market. Our technology is an excellent fit with BTU's, providing our customers with a fully automated, integrated process tools. For Sagarus, it provides the infrastructure to continue to develop and expand our product line, to take advantage of our global market opportunities and provide our customer base with increased service and support based on the extensive global support structure that BTU already has in place. We are excited about being part of the BTU organization." About BTU International BTU International, with world headquarters in North Billerica, MA, USA, is a major supplier of thermal processing equipment to the electronics, materials and semiconductor sectors. BTU manufactures a wide range of equipment for semiconductor packaging applications, including state-of-the-art wafer bumping, solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i. reflow for printed circuit board assembly, where the company is the market leader, and in materials processing Articles on Materials processing include:
About Sagarus Robotics Sagarus Robotics is a leading provider of flux dispensing and process automation for wafer and substrate processing in the semiconductor, automotive and defense industries. Sagarus has a worldwide customer install base including global leaders in the semiconductor industry. Information about Sagarus Robotics is available on the Internet at www.sagarus.com. Safe Harbor Safe Harbor 1. A legal provision to reduce or eliminate liability as long as good faith is demonstrated. 2. A form of shark repellent implemented by a target company acquiring a business that is so poorly regulated that the target itself is less attractive. Statement This news release includes forward-looking statements forward-looking statement A projected financial statement based on management expectations. A forward-looking statement involves risks with regard to the accuracy of assumptions underlying the projections. that involve known and unknown risks and uncertainties, including quarterly fluctuations in results. Such statements are made pursuant to the "safe harbor" provisions established by the federal securities laws, and are based on the assumptions and expectations of the company's management at the time such statements are made. Important factors that could cause actual results to differ include difficulties associated with integrating new product lines or new businesses, undiscovered liabilities associated with newly-acquired businesses, the timely availability and acceptance of new products, general market conditions governing supply and demand, the impact of competitive products and pricing and other risks detailed in the company's filings with the Securities and Exchange Commission. Actual results may vary materially. Accordingly, you should not place undue reliance on any forward-looking statements. Unless otherwise required by law, the company disclaims any obligation to revise or update such forward-looking statements in order to reflect future events or developments. |
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