BOC Helps Semiconductor Manufacturers Improve Productivity and Performance.LIVERMORE, Calif. -- Semiconductor manufacturers who need to improve productivity and performance in operations such as cleaning and soldering can work with BOC (Bell Operating Company) One of 22 companies that was formerly part of AT&T and later organized into seven regional companies. See RBOC. (NYSE NYSE See: New York Stock Exchange : BOX) to develop cost-effective solutions tailored to improve quality, reliability and yield. BOC has partnered with Shinko Seiki, a leading supplier of plasma and vacuum soldering systems in Japan, to assist chip manufacturers with void-free and flux-free advanced solder bumping A technique for attaching chips to a printed circuit board. Tiny globes of solder are attached to the bonding pads on the chip and then melted in place on the board. See BGA and flip chip. . BOC has added Shinko Seiki's hydrogen plasma reflow (1) The process of heating and melting the solder that has been screen printed onto a printed circuit board in order to bond chips and other components to the board. Surface mount chips (SMT) use the reflow method. Contrast with wave soldering. See also reflowable text. technology to its BOC N-Flow(TM) line of lead-free soldering solutions. The new technology provides a truly flux-free soldering process for system-in-package applications and other processes involving wafer bumping, flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done attach and ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. . "Today's devices have an increasing number of connections that require solder bumps. This, combined with shrinking component size, makes it harder for chip manufacturers to remove the flux residue around the solder bumps using traditional wet cleaning processes. The hydrogen plasma reflow process eliminates the need for flux and produces void-free solder bumping and reliable attachment of flip chips," said Kok Whee whee interj. Used to express extreme pleasure or enthusiasm. Teo, vice president, global electronics market sector, BOC. The system, available only through BOC, is offered to customers around the world as a modular or standalone option. Trials and tests can be arranged by contacting BOC. BOC representatives will be available in booth #729 at Semicon West in San Francisco's Moscone Center, July 10-14 to discuss BOC's lead-free soldering capabilities in more detail. In addition, representatives from Livermore, California,-based Eco-Snow Systems, a division of BOC, Inc., will be available to discuss the company's dry, carbon dioxide carbon dioxide, chemical compound, CO2, a colorless, odorless, tasteless gas that is about one and one-half times as dense as air under ordinary conditions of temperature and pressure. snow-based wafer cleaning processes and tools. For stripping high dose, implanted resist, Eco-Snow has developed a unique process that combines dry CO2 cleaning with conventional wet cleaning methods. This process delivers several advantages over plasma ashing, the current method of removing resist. "Plasma ashing promotes oxide growth, which reduces current conduction in the transistor. As transistor sizes shrink, so does the amount of allowable oxide growth. The Eco-Snow technology eliminates oxide growth and subsequent silicon loss in the source/drain extensions and junction modules," said Joe Clark, general manager, Eco-Snow. The process is conducted in a new 300 millimeter cleaning tool called WaferClean(TM) 3600, available in modular or standalone configurations for easy integration within customers' manufacturing processes. "The damage-free particle removal process can also be used for photo mask, MRAM (Magnetic RAM) A non-volatile, random access memory technology that is designed to initially replace flash memory and, potentially, DRAM memory. MRAM uses magnetic, thin film elements on a silicon substrate that can be built on the same chip with the logic circuits. , MEMS (MicroElectroMechanical Systems) Tiny mechanical devices that are built onto semiconductor chips and are measured in micrometers. In the research labs since the 1980s, MEMS devices began to materialize as commercial products in the mid-1990s. , compound and back-end assemblies, such as imaging devices. It can be used to supplement or supplant existing wet cleaning operations," Clark said. For more information about these and other offerings from Eco-Snow, contact us at 925-606-2000 or at info@ecosnow.com. The BOC Group (NYSE:BOX), the worldwide industrial gases, vacuum technologies and distribution services company, is a leader in providing cutting edge solutions to the global electronics packaging industry. Through BOC, Eco-Snow can serve customer's cleaning needs at any location around the world, providing solutions and support worldwide. BOC serves two million customers in more than 50 countries. It employs some 30,000 people and had total revenues of over $8.1 billion in 2005. Further information about The BOC Group may be obtained on the Internet at www.boc.com. |
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