BGA rework station.The X410 ball grid array “BGA” redirects here. For other uses, see BGA (disambiguation). A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. (BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. ) and surface-mount technology rework station is a tool-free, gas-free system based on Focused IR technology. The unit provides profiling and process control for rework of advanced packages and delivers 150W of component heating using lens-based infrared technology. Boards up to 420 X 500 mm are held securely on a macro-micro x/y table. The table features micrometer micrometer (mīkrŏm`ətər, mī`krōmē'tər). 1 Instrument used for measuring extremely small distances. control providing [+ or -]10micron movement in the x and y directions and has a macro override facility. The system delivers component heating through an adjustable lens attachment. Its standard attachment creates heating spot sizes from 25 to 70 mm in diameter. Underside heating is provided by two, switchable, 600W medium wave infrared sources. [ILLUSTRATION OMITTED] PDR PDR A trademark for Physicians' Desk Reference, a group of reference books containing drug listings, especially one for prescription drugs. PDR , West Sussex, UK Booth 1518 |
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