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Axcelis to Present at the Moors and Cabot Semiconductor and Semiconductor Capital Equipment Conference.


BEVERLY, Mass. -- Axcelis Technologies Axcelis Technologies, Inc. NASDAQ: ACLS engages in the design, manufacture, and servicing of capital equipment for the semiconductor manufacturing industry worldwide. , Inc. (Nasdaq: ACLS ACLS
abbr.
advanced cardiac life support
) is pleased to announce that Donald Palette, senior vice president of finance and controller, and James Kawski, director of investor relations Investor relations

The process by which the corporation communicates with its investors.
, will be presenting at the Moors and Cabot Semiconductor and Semiconductor Capital Equipment Conference. This year's conference will be held August 10-11, 2005 at the Pan Pacific Hotel, San Francisco, California “San Francisco” redirects here. For other uses, see San Francisco (disambiguation).

The City and County of San Francisco (EN IPA: [sænfrənˈsɪskoʊ] 
.

Palette and Kawski will present on Wednesday, August 10 at 11:20AM PT. For those who cannot attend, the presentation will be available via live Webcast and archived for 30 days, accessible on the Axcelis Web site at www.axcelis.com.

About Axcelis Technologies, Inc.

Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing Rapid Thermal Processing (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. , and cleaning and curing systems. Axcelis Technologies has key technology centers in Beverly, Massachusetts, as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.
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Publication:Business Wire
Geographic Code:1USA
Date:Aug 4, 2005
Words:175
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