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Axcelis Technologies to Present at the Smith Barney Citigroup Fifth Annual Semiconductor Conference.


Business Editors/High-Tech Writers

BEVERLY, Mass.--(BUSINESS WIRE)--May 25, 2004

Axcelis Technologies Axcelis Technologies, Inc. NASDAQ: ACLS engages in the design, manufacture, and servicing of capital equipment for the semiconductor manufacturing industry worldwide. , Inc. (Nasdaq: ACLS ACLS
abbr.
advanced cardiac life support
), is pleased to announce that Mary Puma, president and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. , and Mark Namaroff, director of investor relations Investor relations

The process by which the corporation communicates with its investors.
 and corporate development, will present at the Smith Barney Citigroup Fifth Annual Semiconductor Conference. This year's conference will be held June 2-3, 2004, at the Monterey Plaza Hotel in Monterey, Calif.

Puma and Namaroff will present on Wednesday, June 2 at 1:30 p.m. PT. For those who cannot attend, the presentation will be available via live Webcast and archived for 30 days, accessible on the Axcelis Web site at www.axcelis.com.

About Axcelis Technologies, Inc.

Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing Rapid Thermal Processing (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. , and cleaning and curing systems. Axcelis Technologies has key technology centers in Beverly, Massachusetts, and Rockville, Maryland as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.
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Publication:Business Wire
Geographic Code:1USA
Date:May 25, 2004
Words:185
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