Axcelis Technologies to Present At the Bank of America Securities Technology Conference.Business/Technology Editors BEVERLY, Mass.--(BUSINESS WIRE)--Jan. 29, 2002 Axcelis Technologies Axcelis Technologies, Inc. NASDAQ: ACLS engages in the design, manufacture, and servicing of capital equipment for the semiconductor manufacturing industry worldwide. , Inc. (Nasdaq: ACLS ACLS abbr. advanced cardiac life support ), is pleased to announce that Mary Puma, president and chief executive officer, and Neil Moses, executive vice president and chief financial officer, will be presenting at the Bank of America
Bank of America (NYSE: BAC TYO: 8648 ) is the largest commercial bank in the United States in terms of deposits, and the largest company of its kind in the world. Securities Technology Conference. This year's conference will be held at the Ritz Carlton Hotel Carlton Hotel can refer to:
Puma and Moses will be presenting on Tuesday, January 30th at 5:30 pm ET. For those who cannot be present at the conference, the presentation will be available via live webcast and archived for 60 days, accessible on our website at www.axcelis.com or directly at the following address: http://www.veracast.com/webcasts/BAS/tech-2002/id67213808.cfm About Axcelis Technologies, Inc. Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing Rapid Thermal Processing (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. , and cleaning and curing systems. Axcelis Technologies has key technology centers in Beverly, Massachusetts, and Rockville, Maryland as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com. |
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