Axcelis Launches New Generation of Ultra Low Energy, High Current Ion Implanters; Ultra Systems Enable High-volume Production of Ultra Shallow Junctions.

Business/Technology Editors

BEVERLY, Mass.--(BUSINESS WIRE)--April 10, 2002

Axcelis Technologies, Inc. (NASDAQ: ACLS), today introduced the Ultra line, the next generation of ultra low energy, high current ion implanters. The GSD Ultra and HC3 Ultra bring more powerful low-energy throughput capability to Axcelis' high current ion implantation platform to enable high-volume production of ultra shallow junctions (USJs) and other sophisticated implant applications in and beyond the 100nm technology node.

"Both the GSD Ultra and HC3 Ultra make advanced transistor formation on a volume-production scale possible," said Mike Luttati, COO of Axcelis. "With 100nm device production on the horizon, Axcelis identified a growing need for a fast yet highly reliable ultra low-energy implant capability in USJ applications. The Ultra implanters take the best of Axcelis' high current implant expertise and combine it with increased beam currents and an easy-access maintenance design, translating to new cost-of-ownership and wafer yield advantages for our customers."

Using Axcelis' proprietary electron confinement technology plus a new beamline design, the Ultra implanters deliver up to 50% more beam current for leading-edge low-energy implant applications. The new beamline is available in a field upgrade package for Axcelis GSDIII/LED's and HC3's.

The GSD Ultra draws on the benefits of Axcelis' GSD multi-wafer endstation, widely recognized for its productivity and reliability in volume production fabs worldwide. Additional productivity benefits of the GSD Ultra include a new packaging design for easier maintenance access and maximum tool uptime. "With more than 1,000 units in the field, the GSD endstation is recognized throughout the industry as a dependable, workhorse wafer handling system," said David Duff, vice president and general manager of Axcelis' ion implantation and rapid thermal processing group. "The GSD endstation's benefits are essential in low energy implant applications, where a multi-wafer platform allows for a short, simple and efficient beamline, and provides the best option for achieving excellent uniformity and process control."

In addition to the GSD Ultra for 200mm applications, Axcelis has introduced the HC3 Ultra for 300mm manufacturing. The HC3 Ultra extends the GSD 200mm platform advantages to 300mm wafers, offering reliable high current processing from 0.2 to 80keV. Like the GSD Ultra, the HC3 Ultra combines Axcelis' low-energy beam transport innovations with a new system layout that allows easy and fast maintenance access for maximum tool productivity and uptime.

About Axcelis Technologies, Inc.

Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing, and cleaning and curing systems. Axcelis Technologies has key technology centers in Beverly, Massachusetts, and Rockville, Maryland as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.

Forward-Looking Statements

This press release includes certain statements, known as "forward-looking statements," which express the current expectations of Axcelis management. Certain risks and uncertainties could cause actual results to differ materially from those currently anticipated as expressed in this press release. Among other factors, such risks and uncertainties include the continuing demand for semiconductor equipment, relative market growth, continuity of business relationships with major customers, competitive pressure on sales and pricing, increases in material and other production costs that cannot be recouped in product pricing and global economic and financial conditions. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other filings from time to time with the Securities and Exchange Commission.