Axcelis Launches FusionES3i 300mm Dry Strip System; Supports Widest Range of Dry Strip Challenges On Single Platform.Business/Technology Editors BEVERLY, Mass.--(BUSINESS WIRE)--June 4, 2001 Axcelis Technologies Axcelis Technologies, Inc. NASDAQ: ACLS engages in the design, manufacture, and servicing of capital equipment for the semiconductor manufacturing industry worldwide. , Inc., (NASDAQ NASDAQ in full National Association of Securities Dealers Automated Quotations U.S. market for over-the-counter securities. Established in 1971 by the National Association of Securities Dealers (NASD), NASDAQ is an automated quotation system that reports on : ACLS ACLS abbr. advanced cardiac life support ), today introduced the FusionES3i, a second-generation 300mm plasma asher. The FusionES3i gives IC manufacturers the ability to handle copper, low-k dielectric, deep trench/via, and other dry strip challenges with a single tool. The new FusionES3i is based on the highly successful, field-proven FusionES3 platform and combines a series of significant performance enhancements that return exceptional throughput and process flexibility. The system features an intelligent downstream microwave plasma Microwaves, being high frequency electromagnetic radiation in the GHz range, are capable of exciting electrode-less gas discharges. Microwave-excited plasmas have two appealing properties: If applied in surface-wave-sustained mode, they are especially well suited to generate source with real-time auto-tuning, which both widens the process window for advanced applications and increases ash rate by as much as 100%. Other enhancements include an independently controlled RF ion assist and modular pre-chamber load locks. The system offers uniform and repeatable processing, while maintaining the ability to ash wafers with the lowest circuit damage levels in the industry. "The need for a reliable and versatile dry strip system has become paramount as chipmakers introduce a widening array of new materials to 300mm manufacturing processes," said Michael Dreyer, vice president and general manager of Axcelis' Photoresist Processing Division. "The FusionES3i combines a mature and production-proven 300mm platform with leapfrog technology additions, such as the intelligent plasma source Plasma sources generate plasmas. Excitation of a plasma requires partial ionisation of neutral atoms and/or molecules of a medium. There are several ways to cause ionisation: collisions of energetic particles, strong electric fields acting on bond electrons, or ionising and ion assist. The result is a highly flexible, modular and cost-effective system that allows our customers to use one tool for virtually all of their dry strip needs." Built on a modular and scalable platform, the FusionES3i will perform bulk strip, advanced polymer removal, and complete dry clean processes in the same chamber. The system has proven process performance in removing polymeric residues over advanced low-k and copper materials. Bridge capability from 200mm to 300mm has been designed in, making the system ideal for both development and volume production environments. A suite of process control and factory automation features help make the tool extendible to the 70nm technology node See technology generation. and beyond. With its ability to handle a wide range of dry strip requirements, the system's single platform concept provides operational efficiencies to customers by simplifying maintenance, operator training, and spare parts Spare parts, also referred to as Service Parts is a term used to indicate extra parts available and in proximity to the mechanical item, such as a automobile, boat, engine, for which they might be used. Spare parts are also called “spares. inventory functions. As with all Axcelis products, the FusionES3i is backed by Axcelis' renowned field equipment and process engineering support. The first shipments of the FusionES3i are expected to begin in the fourth quarter of 2001. The tool will be on display at the SEMICON SEMICON Semiconductors Equipment and Material International Conference West 2001 tradeshow being held July 16-20, 2001 at San Francisco's Moscone Center The Moscone Center is San Francisco, California's largest convention and exhibition complex. The complex consists of two main underground halls underneath Yerba Buena Gardens, Moscone North and Moscone South, as well the three-level Moscone West exhibition hall across 4th Street. . Customers and press are invited to visit the Axcelis booth, number 734 in the South Hall, at any time during the show. About Axcelis Technologies, Inc. Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity manufacturing solutions for the semiconductor industry. Axcelis is dedicated to the design and manufacture of high current, medium current and high energy ion implantation equipment; rapid thermal processing Rapid Thermal Processing (or RTP) refers to a semiconductor manufacturing process which heats silicon wafers to high temperatures (up to 1200 C or greater) on a timescale of several seconds or less. systems; and photostabilization and photoresist stripping equipment. Axcelis Technologies has manufacturing facilities in Beverly and Rockville, Maryland, as well as in Toyo, Japan through its joint venture Sumitomo Eaton Nova. The Company's Internet address is http://www.axcelis.com. |
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