Axcelis' New Single-Wafer Implanter Selected by Major European Chip Manufacturer; Versatile Applications Range, Productivity Key Factors in Customer's Purchase Decision.

BEVERLY, Mass. -- Axcelis Technologies, Inc. (NASDAQ: ACLS) today announced that a leading European chipmaker has selected its new 300mm single-wafer ion implantation platform. The customer chose this platform because of its unique ability to address a broad range of implant applications, including low energy HALO processes.

This is the second customer to select Axcelis' new single-wafer platform, which the company has been developing in anticipation of the industry's growing need for greater productivity and doping precision in high-tilt, low energy implant applications for the 65nm and below technology nodes. Axcelis' new system allows customers to cover a wide array of implant application needs -- from 500eV all the way to 750keV -- with a single tool.

Mike Luttati, Axcelis' chief operating officer, said, "The ion implant landscape is changing. Low energy, high and medium dose implant applications no longer can be neatly grouped into the traditional high current and medium current categories. Instead, we're seeing a need for tools that offer customers the low energy productivity, precision angle control and flexibility to address device scaling challenges beyond the 65nm technology node. Until now, traditional single-wafer architectures were not capable of delivering this range of performance."

To learn more about Axcelis' new single-wafer product platform, please join Axcelis for a webcast at 1:00 p.m. EST on February 16, 2005. The live presentation will be accessible through Axcelis' home page at www.axcelis.com. Prior to the start of the webcast, please access the presentation feed by clicking on "Investors" and "Events" and click on the appropriate icon. For audio only and to participate in the Q&A, dial 1-800-967-7135 (1-719-457-2626 outside North America). Participants calling into the conference call will be requested to provide the company name: Axcelis Technologies and the conference leader: James Kawski. A telephone replay will be available from 8:00 p.m. EST on February 16, 2005 until 11:59 p.m. EST on February 23, 2005. Dial 1-888-203-1112 (1-719-457-0820 outside North America), and enter conference ID code #6444767. A webcast replay will be available from 8:00 p.m. EST on February 16, 2005 until 5:00 p.m. EST on March 16, 2005.

About Axcelis Technologies, Inc.

Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing, and cleaning and curing systems. Axcelis Technologies has key product development centers in Beverly, Massachusetts, as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.

Forward-Looking Statements

This press release includes certain statements, known as "forward-looking statements," which express the current expectations of Axcelis management. Product manufacturing and delivery issues, customer order push-outs or cancellations and product performance could cause actual results to differ materially from those currently anticipated as expressed in this press release. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other filings from time to time with the Securities and Exchange Commission.