Axcelis' Multi-Wafer HC3 Ultra Selected for 300MM DSP Production; New Ultra Beamline Makes HC3 Ultra Preferred Tool for Low-energy Applications.

Business/Technology Editors

Axcelis Technologies, Inc. (NASDAQ: ACLS), today announced that Texas Instruments has ordered multiple HC3 Ultra high-current, low-energy ion implanters. The multi-million dollar sale complements Axcelis' high-energy ion implanters installed at Texas Instruments DMOS6, and demonstrates the rapid adoption of Axcelis' new Ultra ion implant line among leading device manufacturers.

Texas Instruments will use the HC3 Ultra systems to ramp production of advanced DSPs at its DMOS6 300mm fab in Dallas, Texas. Texas Instruments has been a long-term user of Axcelis ion implanters and will now adopt their ultra low-energy tools for the same volume production results. Axcelis' best-of-breed technology complements Texas Instruments' ongoing manufacturing process improvement driven by the migration from 130nm to 90nm technology. The systems are expected to begin shipping in August 2002.

Introduced earlier this year, the HC3 Ultra is the first high-current, ultra low-energy ion implantation system to enable production of ultra shallow junctions (USJ's) and other transistor structures on a volume scale. "The HC3 Ultra uses Axcelis' new Ultra low-energy beamline, which provides increased low-energy beam currents to shorten implant times. This boosts throughput and lowers cost of ownership, and is one of the top reasons why the multi-wafer HC3 Ultra is fast becoming the preferred tool for ultra low-energy applications," said David Duff, Axcelis' vice president and general manager of ion implant and rapid thermal processing (RTP). "Texas Instrument's choice of the HC3 Ultra is just one more example of the wins Axcelis is achieving by delivering best-of-breed technology and productivity."

As device feature sizes shrink below 100nm, leading device manufacturers like Texas Instruments need rapid and reliable ultra low-energy implant capabilities for advanced USJ applications. The multi-wafer HC3 Ultra meets this need by combining Axcelis' field-proven endstation and electron confinement technology with the new Ultra beamline design. The result is a sophisticated yet dependable system that delivers up to 50 percent more beam current for low-energy implant applications.

About Axcelis Technologies, Inc.

Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing, and cleaning and curing systems. Axcelis Technologies has key technology centers in Beverly, Massachusetts, and Rockville, Maryland as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.

Forward-Looking Statements

This press release includes certain statements, known as "forward-looking statements," which express the current expectations of Axcelis management. Certain risks and uncertainties could cause actual results to differ materially from those currently anticipated as expressed in this press release. Among other factors, such risks and uncertainties include the ability of Axcelis and Tritek to finalize their negotiations and consummate the closing, the continuing demand for semiconductor equipment, relative market growth, continuity of business relationships with major customers, competitive pressure on sales and pricing, increases in material and other production costs that cannot be recouped in product pricing and global economic and financial conditions. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other filings from time to time with the Securities and Exchange Commission.