Aviza Technology Introduces New RVP-500 Thermal Process System; Product Affirms Company's Position as Leading Provider of Thermal Process Solutions.

SCOTTS VALLEY, Calif. -- Aviza Technology, a leading supplier of production-proven thermal process systems and an industry innovator in atomic layer deposition (ALD), today introduced the Rapid Vertical Processor - 500 (RVP-500), the company's third-generation vertical diffusion furnace. The RVP-500 is an advanced 300mm mini-batch thermal system offering a compact design, fast response heater, Cross Flow(TM) Chamber and other advanced capabilities that dramatically shorten cycle times and lower the cost of ownership. The first shipment of the tool will be delivered to a leading foundry in Asia at the end of August.

The mini-batch configuration of Aviza Technology's RVP-500 is particularly suited to foundries or fabs that are running multiple process architectures simultaneously, requiring flexible lot sizes. The system is designed for low-pressure chemical vapor deposition (LPCVD) and atmospheric oxidation/diffusion applications and has been specifically optimized to provide the customer with a flexible tool configuration that can meet both advanced process and manufacturing needs.

The RVP-500 incorporates the design advantages of both single wafer and batch processing in one tool. The system uses an advanced five-zone heater that eliminates the need to use costly filler and dummy wafers to compensate for thermal losses at the end of the product load. These innovations -- combined with the Cross Flow(TM) Chamber -- permit a rapid thermal response, provide the flexibility to use smaller load sizes when required, and ensure that all wafers are processed at the same temperature, thereby eliminating thermally induced parametric shifts (lot-to-lot and wafer-to-wafer). Batch sizes can vary from 1-50 wafers (without the use of filler wafers). It is also available with an optional six-FOUP Stocker.

"We have introduced the RVP-500 to address the latest challenges facing the fab floor," said May Su, vice president and general manager of Aviza Technology's thermal business unit. "The RVP-500's reduced footprint occupies 20-40 percent less clean room floor space than alternative systems. It has higher net wafer throughput than competitive products and its design allows for side-by-side placement, with all maintenance occurring from the front and rear of the tool."

The RVP-500 utilizes many of the same successful attributes of earlier generations of the RVP platform, which was first introduced in 1998. The product incorporates the Cell Management System, which enables the control of up to 40 furnaces from a single location. The Cell Management System also controls Aviza Technology's world class Statistical Tool Control (STC) software system, which monitors all critical input/output parameters and provides early warning of maintenance problems or process deviations.

"The RVP-500 is another example of Aviza Technology's commitment to support our customers worldwide with next-generation tools and state-of-the-art process solutions targeted at the 90 and 65nm nodes," said Jerry Cutini, Aviza Technology president and chief executive officer. "Developing new and increasingly flexible systems that exceed our customers needs will allow Aviza Technology to continue to penetrate our served market on a global scale."

About Aviza Technology, Inc.

Aviza Technology, a privately held company, is a leading supplier of thermal processing, low-pressure chemical vapor deposition and atomic layer deposition solutions to the global semiconductor industry. The company maintains a worldwide installed base of more than 2,000 tools. Aviza Technology's headquarters, manufacturing and R&D facilities are located in Scotts Valley, Calif. Additional sales and customer support facilities are located in Germany, France, Scotland, Taiwan, Japan, Singapore and Malaysia. Aviza Technology employs approximately 500 people worldwide. Additional information can be found at www.avizatechnology.com.