Aviza Technology Broadens Low-k Intellectual Property Portfolio.

Company Awarded Low-k Dielectric Patent for Inorganic/Organic Films

SCOTTS VALLEY, Calif. -- Aviza Technology, Inc. (NASDAQ:AVZA), a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, today announced that it has been awarded U.S. Patent No. 7,153,580 entitled "Low-k Dielectric Inorganic/Organic Hybrid Films and Method of Making" for organosilicon-based silicon-organic-carbon (SiOC) films targeted at intermetal dielectric films containing very low dielectric constant values. The patent was issued in December 2006.

"Aviza has a deep portfolio of unique IP that spans multiple technologies," said Nitin Shah, Vice President of Business Development of Aviza Technology, Inc. "We believe that the addition of this latest low-k patent, along with previously issued patents in this area, enhances our overall IP portfolio. We also believe that the suite of low-k patents granted to Aviza will be of significant interest and benefit to chipmakers and semiconductor equipment manufacturers focusing on low-k deposition technologies, as Aviza's patented processes related to this technology virtually spans the entire spectrum of low-k manufacturing. As a result, Aviza is pursuing active licensing programs for our technology."

This new patent covers dielectric films for structures comprised substantially of cyclic Si-O-Si groups and chains as well as organic side groups attached to the structures. The films may be formed in thermal- or plasma-based systems, which utilize organosilicon precursors.

Additional low-k related patents assigned to Aviza include: U.S. Patent No. 6,068,884 and U.S. Patent No. 6,660,391. Patent No. 6,068,884 claims a method of fabricating low-k dielectric films using organosilicon precursors that are not significantly fragmented during deposition, such as films having a backbone structure of inorganic groups with organic side groups attached, if formed. Patent No. 6,660,391 claims dielectric films having a backbone structure substantially comprised of inorganic groups made of 3-dimensional, cross linked matrix of Si-N-Si groups with organic side groups attached to the backbone structure.

Safe Harbor 

This press release contains forward-looking statements. These forward-looking statements are based on our management's current expectations and beliefs and involve numerous risks and uncertainties that could cause actual results to differ materially from expectations. You should not rely upon these forward-looking statements as predictions of future events because we cannot assure you that the events or circumstances reflected in these statements will be achieved or will occur. These forward-looking statements include, but are not limited to, the statements made by Nitin Shah and all statements containing the words "believes," "expects," "may," "will," "should," "seeks," "intends," "plans," "estimates" or "anticipates" or the negative of these words and phrases or other variations of these words and phrases or comparable terminology. Many factors could cause our actual results to differ materially from those projected in these forward-looking statements. Some of these factors and other important factors are detailed in our various Securities and Exchange Commission filings, particularly in our most recent Annual Report on Form 10-K, Quarterly Report on Form 10-Q and registration statement on Form S-1 (File No. 333-139831), as amended, copies of which are available from us without charge. Please review these filings and do not place undue reliance on these forward-looking statements. We assume no obligation to update forward-looking statements.

About Aviza Technology, Inc.

Aviza Technology, Inc. designs, manufactures, sells and supports advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets. The company's systems are used in a variety of segments of the semiconductor market, such as advanced silicon for memory devices, advanced 3-D packaging and power integrated circuits for communications. Aviza's common stock is publicly traded on the NASDAQ Global Market (NASDAQ GM: AVZA). Aviza is headquartered in Scotts Valley, Calif., with manufacturing, R&D, sales and customer support facilities located in the United Kingdom, Germany, France, Taiwan, China, Japan, Korea, Singapore and Malaysia. Additional information about the company can be found at http://www.avizatechnology.com.