Automatic AXI.Microme|x high-resolution x-ray inspection system has a 20 X 24" scanning area, a precise manipulation unit with 360[degrees] rotation axis and approved ovhm technology for oblique views up to 70[degrees] at constant magnification. Operators can inspect large boards with mixed assemblies and acquire real-time oblique views under all angles. Has board handling unit connection for fully automated loading of assembled boards in the production plant. Inspects BGA (Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. , CGA (Color/Graphics Adapter) The first video display standard for the IBM PC. This low-resolution system was superseded by EGA and then VGA. CGA required a digital RGB Color Display monitor. See PC display modes. CGA - Color Graphics Adapter , QFP (Quad FlatPack) A square, surface mount chip package that has leads on all four sides and comes in several varieties. PQFP (Plastic QFP) may refer to all of the following QFP types. All quad flatpacks use gull-wing leads, except for the CQFP, which stick straight out. , THT THT The Hardball Times (baseball website) THT Terrence Higgins Trust (UK HIV/AIDS charity) THT Through Hole Technology THT The Human Touch THT Technische Hogeschool Twente and other solder joints. [ILLUSTRATION OMITTED] Phoenix X-ray Systems + Services GmbH, phoenix-xray.com |
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