Automated gold wire bonder.
Model 8000 gold ball-and-stitch thermosonic wire bonder is ideal
for complex multichip applications, high I/O (Input/Output) The transfer of data between the CPU and a peripheral device. Every transfer is an output from one device and an input to another. See PC input/output.
I/O - Input/Output count devices and gold ball
bumping Bumping can refer to: - Bump (union), a re-assignment of jobs on the basis of seniority in unionised organisations
- Bump (Internet), a technique used on an internet forum to raise a topic thread's profile
- Lock bumping, a method of lock picking
for flip chip A chip packaging technique in which the active area of the chip is "flipped over" facing downward. Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done . Incorporates a 300 X 150 mm x-y range linear
motor-actuated positioner. The 72 i[n.sup.2] (45,000 m[m.sup.2]) work
area accommodates dual handling systems. Said to achieve accurate
targeting and wire placement of better than 5 [micro]m.
Palomar Technologies, bonders.com
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