August Technology Receives Two Repeat Orders for Award Winning 3Di Inspection.Business Editors & High-Tech Writers MINNEAPOLIS--(BUSINESS WIRE)--Sept. 5, 2002 System Premier Taiwanese subcontractor One who takes a portion of a contract from the principal contractor or from another subcontractor. When an individual or a company is involved in a large-scale project, a contractor is often hired to see that the work is done. and U.S.-based IDM (1) See identity management. (2) (Integrated Device Manufacturer) A company that performs every step of the chip-making process, including design, manufacture, test and packaging. Examples of IDMs are Intel, AMD, Motorola, IBM, TI and Lucent. choose 3Di Series for production-level 300mm bumped wafer inspection August Technology (Nasdaq:AUGT) today announced it has received two repeat orders for 3Di Series wafer and bump inspection systems. The orders are from a premier Taiwanese subcontractor and a leading U.S.-based integrated device manufacturer See IDM. (IDM). "These repeat orders are a direct result of the 3Di Series' ability to solve the unique challenges of our customers' applications," said Greg Stark, 3Di Series product manager. "The flexibility of our award winning 3Di systems provides customers with the ability to quickly inspect both whole and sawn wafers at all wafer sizes, including 300mm, as well as to perform both 2D and 3D inspection on gold, copper and solder bumping A technique for attaching chips to a printed circuit board. Tiny globes of solder are attached to the bonding pads on the chip and then melted in place on the board. See BGA and flip chip. technologies." "These orders highlight the confidence our customers have in the 3Di Series automated bump inspection systems, which were specifically designed to address the needs of chip manufacturers using advanced packaging technology. As microelectronic device manufacturers continue to rapidly adopt wafer level bumping, the need for automated bump inspection continues to grow," explained Jeff O'Dell, August Technology's chairman and chief executive officer. "For some device manufacturers inspection is critical for process understanding and improvement, for others automated inspection serves as assurance that only good devices are shipped to their customers. In both cases, it is the information provided by automated inspection that our customers need, and August Technology's 3Di continues to demonstrate its ability to provide them with this critical process information." August Technology's 3Di-8000, winner of Advanced Packaging Magazine's 2002 Inspection Product of the Year, is one in a series of high-speed wafer and bump inspection and metrology systems which provide critical process information to the rapidly growing advanced packaging market. According to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. industry research by Dataquest, the number of bumped wafers is expected to grow by 288% over the next four years. The 3Di Series enables bumped device manufacturers to lower their time to market and cost of manufacturing. Incorporating August Technology's patent-pending three-dimensional (3D) Rapid Confocal confocal see confocal microscopy. Sensor(TM), with proprietary two-dimensional (2D) bump and active die inspection technologies, the 3Di Series provides bump manufacturers with high-speed and high accuracy combined in a single bump inspection solution. August Technology Corporation, based in Bloomington, Minnesota Bloomington is a city in Hennepin County, Minnesota, and a southern suburb of Minneapolis. As of 2005, it had a population of 84,347, making it the largest Twin Cities suburb, and the fifth largest city in the state[1]. , is a leading supplier of automated visual defect inspection equipment for the microelectronic industries and has established worldwide service and sales representation. The inspection solutions designed, manufactured and marketed by August Technology provide critical product and process enhancing information enabling microelectronic device manufacturers to drive down costs and time to market. August Technology is a founding member of the Advanced Packaging and Interconnect Alliance (APiA) and an active member of the Die Products Consortium (DPC DPC Department of Premier and Cabinet (Victoria, Australia) DPC Dutch Power Cows DPC Deferred Procedure Calls (Microsoft Windows NT 4. ). Additional information can be found by visiting August Technology's web site at www.augusttech.com. Forward-Looking Statements forward-looking statement A projected financial statement based on management expectations. A forward-looking statement involves risks with regard to the accuracy of assumptions underlying the projections. : This release contains forward-looking statements that involve risks and uncertainties including statements regarding orders, which have not yet been installed or accepted, and actual results may differ from those set forth in the forward-looking statements, because of the risks and uncertainties, including but not limited to deterioration de·te·ri·o·ra·tion n. The process or condition of becoming worse. in general economic conditions, further downturns in the microelectronics industry, further softening of the financial markets, or any unforeseen difficulties in the development, manufacture, shipment, delivery and/or acceptance of our products or in the economy in general. Please refer to additional risk factors stated in August Technology's Form 10-K Form 10-K A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information. Form 10-K See 10-K. Registration Statement filed with the Securities and Exchange Commission. |
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