August Technology Receives Significant Order From Leading Semiconductor Manufacturer for 3D Inspection Solution.Business Editors & Technology Writers BLOOMINGTON, Minn.--(BUSINESS WIRE)--July 25, 2001 August Technology Corporation (Nasdaq:AUGT) today announced it has received an order for its new 3Di-8000 bump inspection system from a leading semiconductor manufacturer. The system is expected to ship during the third quarter and will be installed at the customer's facility in the United States United States, officially United States of America, republic (2005 est. pop. 295,734,000), 3,539,227 sq mi (9,166,598 sq km), North America. The United States is the world's third largest country in population and the fourth largest country in area. for the inspection of wafer level bumps. "We have now received several orders for our 3Di-8000, the latest from another major semiconductor company, which we believe is a strong endorsement for our revolutionary Rapid Confocal confocal see confocal microscopy. SensorTM (RCS (1) (Remote Computer Service) A remote timesharing service. (2) (Revision Control System) A Unix utility that provides version control. RCS - Revision Control System ) technology," explained Jeff O'Dell, August Technology's president and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board. . "The fact that this customer evaluated competitive 3D inspection technologies and chose the 3Di-8000 proves the superiority of the RCS when compared to alternative technologies such as laser-based scanning and shadowing." O'Dell continued, "Our customers are looking for Looking for In the context of general equities, this describing a buy interest in which a dealer is asked to offer stock, often involving a capital commitment. Antithesis of in touch with. an accurate, repeatable and very fast 3D inspection solution. The 3Di-8000 has set a new standard for this level of performance." The 3Di-8000 is a flexible system designed for high-speed, 2D and 3D micro defect inspection of wafers, discrete die and wafer level bumps. The tool is capable of providing device manufacturers with defect information for process analysis throughout the final device manufacturing process. The system quickly and accurately measures the height and coplanarity In geometry, a set of points in space is coplanar if the points all lie in the same geometric plane. For example, three points are always coplanar; but four points in space are usually not coplanar. of solder solder (sŏd`ər), metal alloy used in the molten state as a metallic binder. The type of solder to be used is determined by the metals to be united. Soft solders are commonly composed of lead and tin and have low melting points. Hard solders (i. and gold bumps in addition to incorporating 2D inspection capabilities for characteristics such as bump placement and size, as well as active die area inspection. The system is capable of inspecting wafers from 50 to 300 millimeters, bridging the transition to larger wafer sizes. According to according to prep. 1. As stated or indicated by; on the authority of: according to historians. 2. In keeping with: according to instructions. 3. market research firm TechSearch International, Inc., the wafer level bumping market is expected to grow at a rate of over 350 percent from 800 million bumped units in 2000, to 3.75 billion bumped units by the year 2005. Forward-Looking Statements: This release contains forward-looking statements that involve risks and uncertainties including statements regarding the capabilities and market acceptance of the new 3Di-8000 product offering, and orders that have not yet been shipped and delivered. These forward-looking statements involve risks and uncertainties that may cause actual results to differ from those set forth in the forward-looking statements, including but not limited to deterioration in general economic conditions, downturns in the semiconductor or microelectronics industry, or any unforeseen difficulties in the development, manufacture, shipment, installation, performance or market acceptance of our products. Please refer to additional risk factors stated in August Technology's Form 10-K Form 10-K A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information. Form 10-K See 10-K. filed with the Securities and Exchange Commission. August Technology Corporation, based in Bloomington, Minnesota Bloomington is a city in Hennepin County, Minnesota, and a southern suburb of Minneapolis. As of 2005, it had a population of 84,347, making it the largest Twin Cities suburb, and the fifth largest city in the state[1]. , is a leading supplier of automated visual defect inspection equipment for the microelectronics industry and has established service and sales representation in all major microelectronic markets worldwide. The inspection solutions designed, manufactured and marketed by August Technology, provide device manufacturers with cost-saving, quality and process information. Additional information can be found by visiting August Technology's web site at www.augusttech.com. |
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