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August Technology Introduces NSX-105 Wafer Defect Inspection System; New Tool Doubles Throughput to 120 Wafers per Hour.


Business Editors & Technology Writers

MINNEAPOLIS--(BUSINESS WIRE)--July 25, 2002

August Technology Corporation (Nasdaq:AUGT) today officially launched the NSX-105, the newest addition to the NSX NSX New Sportscar eXperimental (concept name for Acura vehicle; originally NS-X)
NSX Namespace Extension (Windows Shell Programming)
NSX N Syndrome
NSX Network and Security Experts
NSX New Sports Experimental
 Series of automated wafer and bump defect inspection solutions. The NSX-105, first presented at SEMICON SEMICON Semiconductors Equipment and Material International Conference  West 2002, has been developed specifically for high-volume wafer manufacturing environments requiring 100% micro defect inspection.

With a throughput of up to 120 wafers per hour (200mm wafers), the NSX-105 is twice as fast as the NSX-95, previously the industry standard for high-speed inspection. The NSX-105 features optimized handling and image processing image processing

Set of computational techniques for analyzing, enhancing, compressing, and reconstructing images. Its main components are importing, in which an image is captured through scanning or digital photography; analysis and manipulation of the image, accomplished
, in addition to the Company's latest staging, camera, optics and processor technology. The new system is ideally suited for high volume 200mm and 300mm whole wafer and film frame applications.

"Our NSX systems provide the "visual information" about devices that manufacturers need to optimize their processes, enabling them to further reduce costs and drive down time to market," explained Jeff O'Dell, chairman and CEO (1) (Chief Executive Officer) The highest individual in command of an organization. Typically the president of the company, the CEO reports to the Chairman of the Board.  of August Technology. "The NSX product family continues to offer unmatched price/performance in fully automated micro defect inspection to meet a wide variety of customer applications and requirements. The enhancements we've made to the new NSX-105 dramatically reduce the cost of ownership for high resolution, very high throughput applications."

The NSX Series automatically inspects for visual defects down to 0.5 micron such as scratches, particles, passivation passivation

the final stage in instrument manufacture, passing the finished instruments through a bath of nitric acid which removes foreign particles and promotes the formation of a protective coating of chromium oxide.
 holes, and other defect types as well as two dimensional (2D) bump defects such as bumps that are over- or undersized undersized

see dwarfism, runt.
, misshaped, misplaced mis·place  
tr.v. mis·placed, mis·plac·ing, mis·plac·es
1.
a. To put into a wrong place: misplace punctuation in a sentence.

b.
, and others. Additionally, the NSX Series systems can be configured to perform 100% 2D inspection while also performing sample-based three-dimensional (3D) inspection.

August Technology Corporation, based in Bloomington, Minnesota, is a leading supplier of automated visual defect inspection equipment for the microelectronic industries and has established worldwide service and sales representation. The inspection solutions designed, manufactured and marketed by August Technology provide critical product and process enhancing information enabling microelectronic device manufacturers to drive down costs and time to market. August Technology is a founding member of the Advanced Packaging and Interconnect Alliance (APiA) and an active member of the Die Products Consortium (DPC DPC Department of Premier and Cabinet (Victoria, Australia)
DPC Dutch Power Cows
DPC Deferred Procedure Calls (Microsoft Windows NT 4.
). Additional information can be found by visiting August Technology's web site at www.augusttech.com.
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Copyright 2002, Gale Group. All rights reserved. Gale Group is a Thomson Corporation Company.

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Comment:August Technology Introduces NSX-105 Wafer Defect Inspection System; New Tool Doubles Throughput to 120 Wafers per Hour.
Publication:Business Wire
Geographic Code:1USA
Date:Jul 25, 2002
Words:367
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