August Technology Extends NSX Series in Chipbond's Bumping Facility.Business Editors & Technology Writers MINNEAPOLIS--(BUSINESS WIRE)--April 29, 2002 August Technology Corporation (Nasdaq:AUGT) today announced that Chipbond, one of the world's leading providers of gold and solder bumping A technique for attaching chips to a printed circuit board. Tiny globes of solder are attached to the bonding pads on the chip and then melted in place on the board. See BGA and flip chip. services, has ordered three additional NSX-95 wafer (1) A small, thin continuous-loop magnetic tape cartridge that has been used from time to time for data storage and specialized applications. (2) The base unit of chip making. It is a slice taken from a salami-like silicon crystal ingot up to 12" (300mm) in diameter. inspection systems to be installed in their bumping facility in Taiwan. Chipbond is the first foundry to provide gold bump packaging services in Taiwan. "We're excited about the opportunity to continue supplying Chipbond with the inspection equipment required to meet their advanced packaging production needs and we look forward to further developing our relationship with a market leader such as Chipbond," stated David Klenk, August Technology's president and chief operating officer Chief Operating Officer (COO) The officer of a firm responsible for day-to-day management, usually the president or an executive vice-president. . "Chipbond is growing rapidly in response to the increasing demand for advanced interconnects, in particular gold bumps which are often used on drivers for micro displays used in cell phones, PDAs and other consumer electronics. The additional NSX NSX New Sportscar eXperimental (concept name for Acura vehicle; originally NS-X) NSX Namespace Extension (Windows Shell Programming) NSX N Syndrome NSX Network and Security Experts NSX New Sports Experimental systems will allow them to closely monitor their processes and product quality as they bring additional capacity on-line." "The NSX Series provides us with the information necessary to improve our processes, allowing us to enhance our yields and efficiencies, and provide our customers with the best bumping process possible," explained Fei-Jain Wu, Chipbond's president. This latest sale into the rapidly growing advanced packaging industry, in addition to the recently announced shipment of the 50th bump inspection system, supports August Technology's position as leader of the micro defect inspection market. The NSX Series automated inspection systems are used by microelectronics device manufacturers to inspect products for visual defects down to one half micron micron: see micrometer. One micrometer, which is one millionth of a meter or approximately 1/25,000 of an inch. The tiny elements that make up a transistor on a chip are measured in micrometers and nanometers. See process technology. . These defects may cause affected devices to under-perform or fail. The information provided by the NSX Series allows manufacturers to control the quality of products being shipped and enhance their manufacturing processes, resulting in higher yields and faster time to market. Forward-Looking Statements forward-looking statement A projected financial statement based on management expectations. A forward-looking statement involves risks with regard to the accuracy of assumptions underlying the projections. : This release contains forward-looking statements that involve risks and uncertainties including statements regarding this order that has not yet been delivered, installed or accepted. These forward-looking statements involve risks and uncertainties that may cause actual results to differ from those set forth in the forward-looking statements, including but not limited to any unforeseen difficulties in the development or manufacture, shipment, delivery and acceptance of our products or in the economy in general. Please refer to additional risk factors stated in August Technology's form 10-K Form 10-K A report required by the SEC from exchange-listed companies that provides for annual disclosure of certain financial information. Form 10-K See 10-K. as filed with the Securities and Exchange Commission. August Technology Corporation, based in Bloomington, Minnesota Bloomington is a city in Hennepin County, Minnesota, and a southern suburb of Minneapolis. As of 2005, it had a population of 84,347, making it the largest Twin Cities suburb, and the fifth largest city in the state[1]. , is a leading supplier of automated visual defect inspection equipment for the microelectronics industry and has established service and sales representation in all major microelectronics manufacturing markets worldwide. The inspection solutions designed, manufactured and marketed by August Technology provide microelectronic device manufacturers with cost-saving quality and process information. August Technology is a founding member of the Advanced Packaging and Interconnect (1) To attach one device to another. (2) A physical port (plug, socket) or wireless port (transmitter, receiver) used to attach one device to another. Alliance (APiA) and is an active member of the Die Products Consortium (DPC DPC Department of Premier and Cabinet (Victoria, Australia) DPC Dutch Power Cows DPC Deferred Procedure Calls (Microsoft Windows NT 4. ). Additional information can be found by visiting August Technology's web site at www.augusttech.com. |
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